Informations

E3 Spring School (Energy Efficient Electronics) is an International School with a 4-days course aimed at providing training for graduate students, postdoctoral, technologists, engineers and scientists from universities, laboratories and companies, all around the world, in the field of Energy Efficient Electronics. Courses cover the fundamentals and applications of selected fields that were chosen as being very important aspects of future Micro- and Nano-electronics; many of these are connected with running EU and advanced international research projects.

Semiconductors are at the heart of the digital revolution. In recent years this sector has experienced incredible progress. This is the result of improved materials, devices, circuit and system architectures, and integration technologies that open the possibility to develop present applications and to create new ones. Nanoelectronics provides miniaturization, increased performance and production in high numbers, so electronic systems can be deployed in multiple scenarios, including computing, communication systems, smartphones, AI hardware, automotive, health, environment, space and energy, that powers our everyday lives and tomorrow’s innovations.

However, electronic systems face major challenges for the next decades. In particular, one of the biggest challenges is their energy consumption. This is, especially true for AI and Telecom applications, whose demand of energy increases exponentially and, in light of the current trend, could reach the worldwide energy production in the next 2 or 3 decades if no efficient disruptive solutions are proposed.

The aim of this E3 International Spring School is to offer training activities covering the challenges and possible solutions for future energy efficient electronics spanning from novel materials and devices to advanced system integration. Talks will be delivered by representatives from leading universities, research institutes and companies in Europe and Asia.

Program

E3 International Spring School invites you to spend 4 days diving into the fascinating world of chips, and to connect with researchers from leading semiconductor countries. You will attend advanced lectures and engage in scientific exchange with leading experts from academia and industry, and build your network.

The program will cover the following topics :

1. Heterogeneous integration and advanced packaging for future electronic systems

  • General Overview/Introduction: perspective of large scale
  • 2.5D and 3D heterogeneous integration technologies
  • Chiplet Integration technology

2. Novel materials for memory and logic

  • Ultra-thin semiconductors (GOI, FD-SOI, …)
  • 2D materials (and related dielectrics)
  • Advanced beyond-CMOS functional materials

3. Advanced logic and memory devices

  • Advanced logic devices (nanosheet, FDSOI, FiNFET, CFETs, 2D/ 1D)
  • Advanced Emerging memories (RRAM, PCRAM, MRAM, FeRAM, FeFET)
  • Steep-slope switches
  • Advanced characterization for nanoscale materials and devices
  • Modelling (new strategies and requirement, …)

4. New computing architectures/paradigms: Advanced computing for AI

  • Neuromorphic computing
  • Near- and in-memory computing
  • Quantum computing

5. Energy efficient smart power and smart sensing components

  • Energy management, Wide-bandgap materials, Co-integration, Power electronics
  • Smart Sensing for low power applications

Venue

L’ESCANDILLE
931 Route de la Sure
38880 Autrans Méaudre en Vercors, FRANCE
  • APRIL, 26-30, 2027

  • AUTRANS

    France

  • Registration

    Will open soon