HMU – Hellenic Mediterranean University

Contact persons:

Emmanuel Kymakis, Konstantinos Rogdakis

HMU – Hellenic Mediterranean University

Estavromenos,

71410 Heraklion,

Crete, Greece

Main expertises

  • Halide perovskite memristors (mixed-halide, low-dimensional and lead-free, e.g. Cs3Bi2I9, AgBiI4) emulating synaptic and neuronal functions
  • Volatile (threshold) and non-volatile resistive switching; gate-tunable memristors operating at low switching fields
  • Coordinator of EIC Pathfinder ELEGANCE (GA 101161114) on flexible neuromorphic engines
  • Solution-processable graphene and other 2D-related crystals: functionalisation and doping to fine-tune energy levels and work function
  • 2D-material interface engineering for charge-selective contacts and electrodes
  • 2D materials in perovskite solar cells and modules, up to solar-farm scale (cover on Nature Energy 2022)
  • Solution-processed halide perovskite semiconductors (lead-based and lead-free) for electronic and optoelectronic devices

Research interests

  • Sustainable, solution-processed neuromorphic hardware for classification and pattern-recognition tasks
  • Printed/flexible neuromorphic engines for edge and IoT applications
  • Memristive solar cells: merging energy harvesting with in-sensor/in-memory computing in a single stack
  • Printed 2D-semiconductor thin-film transistors (EIC Pathfinder HYPERSONIC)
  • 2D-material-based memristors and printed electronics for IoT
  • Mixed-dimensional (2D/3D) perovskite heterostructures for stable, durable devices

Main expertises

  • Halide perovskite resistive switching memories, incl. mixed-dimensional perfluoroarene perovskite heterostructures with enhanced durability (Nanoscale Horizons 2024)
  • Memristor electrical testing incl. sub-µs pulsed and C–V measurements (Keithley 4200A-SCS with ultra-fast pulse module; Agilent B1500A with shielded probe station)
  • Memristors switching at low electric fields (Advanced Electronic Materials 2023)

Research interests

  • Printed, flexible resistive memories for hybrid printed/Si chips
  • Improving the endurance, retention and variability of solution-processed memories
  • Low-power, self-powered IoT nodes combining energy harvesting with memory and computing

Main expertises

  • Printed sensors from solution-processable inks
  • Interfacial engineering of perovskite and organic solar cells and modules for performance and stability (EU projects: Graphene Flagship, Laperitivo, Solarup EIC pathfinder)
  • Indoor (low-light) and outdoor PV characterisation; 40-channel laboratory for ISOS ageing protocols
  • World’s first graphene–perovskite outdoor solar farm: operando reliability testbed, benchmarked against commercial CIGS, CdTe and poly-Si panels
  • Perovskite and organic optoelectronic devices; optoelectronic characterisation (EQE, TRPL, PLQY, LBIC mapping)
  • Printed, flexible electronics from solution-processable inks: roll-to-roll slot-die/flexographic, screen, doctor-blade and ultrasonic-spray coating
  • High-resolution printing down to 1 µm (XTPL Delta printer)
  • Operando and field reliability: degradation and drift of emerging devices under realistic conditions
  • Advanced characterisation: KPFM/PFM atomic force microscopy, photoemission yield spectroscopy (work function), Hall effect (300 K)

Research interests

  • Printed sensors co-integrated with energy harvesters and memristive elements for autonomous IoT nodes
  • Indoor photovoltaics for powering IoT devices
  • Sustainable PV technologies (EIC Pathfinder SOLARUP)
  • Light-responsive (optoelectronic) memristive devices for in-sensor computing
  • Printed electronics for IoT using 2D materials
  • Flexible neuromorphic engines (ELEGANCE)
  • Community benchmarking of emerging devices under realistic operating conditions
  • Opening HMU infrastructure to the community (via INFRACHIP and EMERGE)

Main expertises

  • Integration of 2D-material-based perovskite solar panels into a stand-alone solar farm (Nature Energy 2022)
  • Multi-scale printed integration, from a laser-based PCB pilot line (hundreds of µm) down to 1 µm (XTPL printer)
  • Partner and access provider in INFRACHIP (GA 101131822), the European research infrastructure on semiconductor chips

Research interests

  • Autonomous, self-powered IoT nodes integrating energy harvesting, sensing and in-memory computing
  • Hybrid chips combining printed and conventional Si microelectronics for sustainable IoT (Discover Materials 2024)