Abstract

We are please to announce that the 2026 IRDS/ISRDS Workshop will take place this year in Granada.

During two days, experts will present the latest update of main IRDS chapters, and discuss new direction in computing, and new directions of materials & devices for computing.

Day 1 – IRDS – Annual Update of Roadmap Summaries

Day 2 – 2D Tutorial & ISRDS (International Symposium on Roadmapping Devices and Systems)

IRDS represents the main International Roadmap of the Electronic Industry. The main challenges and possible solutions covering materials, devices and systems for many applications in the next 15 years will be highlighted.

The ISRDS will be dedicated to new direction in computing, including neuromorphic, probabilistic, reversible, and quantum computing, and new directions of materials & devices for computing, including 2D and ferroelectric materials, steep slope devices, quantum materials and devices, spintronics and cryogenic electronics.

Venue

Assembly Hall of the Faculty of Medicine
Tower B, Floor 1
University of Granada
PTS Parque Tecnológico de la Salud

Avda. Doctor Jesús Candel Fábregas 11, 18016 Granada

https://medicina.ugr.es/

You may also be interested in

EUROSOI-ULIS 2026

20-22 May, 2026

The IRDS/ISRDS Workshop is organised as part of the EUROSOI-ULIS Conference, which will be held at the same venue, on May 20-22, 2026.

Important Dates

Notification of acceptance: March 31, 2026
Registration opening: March 1, 2026
Early Bird registration deadline: April 20, 2026
Dates of the congres: March 20-22, 2026

Preliminary Programme

Day 1 | IRDS – Annual Update of Roadmap Summaries | 18 May, 2026

Biography: In the 70s Dr. Gargini was a researcher at Stanford University and at Fairchild Cameraand Instrument. In 1980 as manager of MPU technology at Intel transferred intomanufacturing the iconic 80286 and 80386. In 1996, he became Director ofTechnology Strategy and responsible for worldwide consortia research until 2012. Hewas a member of Sematech, SRC, EUV LLC, EIDEC, ASET, IMEC and SIA Boards, andChairman of the I300I and NRI. From 1998 to 2015, Dr. Gargini was Chairman of theITRS sponsored by the WSC. Since 2016 he is the Chairman of the IRDS sponsored byIEEE.

Abstract: This presentation focuses on recent developments in Yield Enhancement, one of the most critical areas enabling advanced semiconductor manufacturing. The Yield Enhancement forum and its associated initiatives incorporate contributions from team members across the United States, Europe, and Japan. The scope of Yield Enhancement prioritizes contamination control challenges, for which solutions often require many years to develop and mature. Over the past year, much of the work has focused on advancing the understanding of defectivity in next-generation devices, informed by extensive collaboration between the Yield Enhancement and More Moore teams.

Biography: Dr. Slava Libman is Chief Executive Officer of FTD Solutions, a company advancing digital platforms for water management and environmental performance in industrial operations. He brings three decades of experience in water technology, with deep expertise in the semiconductor sector across technical, operational, and executive leadership roles. Dr. Libman serves as Co-Chair of the semiconductor technology roadmap, where he leads initiatives in Environmental Sustainability and Yield Enhancement. He is also involved in the development of industry standards in these domains and organizes technical conferences and webinars that shape cross-industry collaboration. Prior to co-founding FTD Solutions, Dr. Libman held senior roles at a leading semiconductor manufacturer, a global architecture and engineering firm, and a premier analytical laboratory. He earned a Ph.D. in Environmental Engineering from the Technion – Israel Institute of Technology.

Abstract: Since the IRDS inception in 2017, the Applications Benchmarking (AB) and Systems and Architectures (SA) International Focus Teams (IFT) have contributed the tops down guidance to the IRDS communities. AB shared insight into what we need to compute and tracked the capabilities of systems to achieve those needs while SA provided insight on where that computing occurs across system categories from IoT Edge beacons to exascale supercomputers. The rapid adoption of generative AI has provided an unprecedented stochastic shock to the entire IT ecosystem, which demands changes to our methodology and has led to the merger of the two teams.

Biography: Vladimir Getov is a professor of distributed and high‑performance computing at the University of Westminster and an active IEEE Computer Society volunteer since the mid‑1990s. He has served on the IEEE CS Board of Governors and contributed to both the Publications Board and the Technical and Conference Activities Board. He has held numerous leadership roles, including area editor for Computer since 2008 and chair positions for several IEEE conferences. His career spans industry and academia, with early work in computer development and later academic appointments in Southampton and Westminster. He has played a key role in international initiatives such as the PARKBENCH Committee, the Java Grande Forum, and the Open Grid Forum. Getov has received multiple prestigious awards and is a Senior Member of IEEE and ACM as well as a BCS Fellow.

Coffe Break

Abstract: Robotic workloads are fundamentally characterized by continuous sensor streams, sparse and irregular computation, tight perception–action loops, and strict real-time and energy constraints. This AMC roadmap update focuses on the core message that dataflow architectures are uniquely well suited to these demands, as they enable event-driven execution, fine-grained parallelism, and locality-aware computation across heterogeneous sensing, learning, and control pipelines. By aligning computation with data availability rather than instruction sequencing, dataflow architectures offer superior scalability, energy efficiency, and responsiveness, making them a critical enabler for autonomous machines operating in dynamic, real-world environments under the IEEE IRDS framework.

Biography: Jean‑Luc Gaudiot is a Distinguished Professor of Electrical Engineering and Computer Science at the University of California, Irvine. He previously served as Professor at the University of Southern California and later chaired the EECS Department at UCI, where he led significant growth and faculty recruitment. He is the recipient of the 2026 Richard E. Merwin Award for Distinguished Service. He has held major leadership roles within the IEEE and the IEEE Computer Society, including serving as President of the IEEE Computer Society in 2017. His research focuses on parallel system programmability, hardware‑based computer security, and autonomous driving systems, with nearly 300 refereed publications. He was elected IEEE Fellow in 1999 and AAAS Fellow in 2007.

Abstract: Factory Integration includes everything that is needed to keep semiconductor manufacturing operation in the Fab undisrupted at affordable cost and in sustainable manner. Its planned focus areas in coming version, such as Digital Twin interoperability in fab and beyond, smart manufacturing advancement through adoption of robotics, and security aspects of semiconductor manufacturing operations, will be discussed in this presentation.

Biography: Supika Mashiro works as an Advisor for Tokyo Electron Limited at its HQ in Tokyo, Japan. She has been involved in Factory Integration (FI) IFT of IRDS since its inauguration in 2016 and a cochair since 2017. Her area of interest and involvement encompasses smart manufacturing as well as environment and safty/ Sustainability road-mapping and related industry standard development. Contact her at supika.mashiro@tel.com.

Abstract: Today industry trend is application driven by system architecture solutions.  This was one of the transformative reasons from the old ITRS process-device-technology centered roadmap toward IRDS System and Device centered.  This transformation of the industry cannot be done without yield and high-volume manufacturing solution.  Metrology need to embrace the new paradigm and transform itself from a material and process centered control tool to at most holistic innovation and acceleration one. Consequently, from the holistic approach, metrology will need to consider Material to System Technology Co Optimization MSCO needs and cross domain data and knowledge exchange to support this approach.  In the methodology and tools aspects metrology need to integrate IA to break knowledge and data silos in the FAB to accelerate yield learning.  Finally at the material and process level metrology will need to track traditional issues from Material/Process perspective but will need to include System/application metrology data that can add constraints or degree of freedom for the MSCO approach.

Biography: More than 25 years in semiconductor from Research, R&D up to Industrial application.  September 2022-now, Key Account Manager CEA-Leti, Materials Program Line Manager and Metrology Expert for the Technological Research Division.  2020-2022 Vice President Strategic Alliance at Unity-Semiconductor, 2029 Vice President R&D Unity Semiconductor.  From 2009-2019 at Leti, work at different positions in metrology activities (Metrology R&D business development, Metrology Silicon Platform Division Deputy Manager, Scientific Manager of In-line Metrology Laboratory).  Previously Application Engineer for 8 years with KLA-Tencor from junior to senior worldwide support.

Abstract: The IRDS 2025 lithography and Patterning roadmap has recently been published.  High NA exposure tools are in full use in chip process development and are expected to be used in production as early as next year.    They provide better resolution and simpler processes for upcoming logic products but also have a smaller field size. Key challenges are stochastics, process control, overlay, small field sizes and cost.  Addressing these challenges will require improved masks, higher power light sources, improved resists and many process improvements.  The requirements for better interchip connections are expected to drive improved packaging lithography.  After 0.55NA lithography, hyper NA EUV with an NA in the range of 0.75 may be implemented if it is cost effective as a replacement for 0.55NA EUV with multiple patterning.   Research efforts on shorter wavelengths than EUV are underway, but so far there is no consensus or feasibility demonstration on any of the several wavelengths under consideration.  Nor are there device structures in the current IRDS roadmaps that clearly need the capabilities of a shorter wavelength.   Device structures are becoming more three dimensional, with some circuit elements moving to the back of the chip.  This creates challenges in overlay and patterning, but slows down the rate of scaling on the front of the chip.

Biography: Mark Neisser is a chair professor in the School of Integrated Circuits at Tsinghua University.   He is also the Director of the Photoresist lab at the Integrated Circuit Research Platform at the International Innovation Center of Tsinghua University, Shanghai.  He received his B.S. degree in chemistry from Cornell University and his M.S. and Ph.D.  degrees in chemistry from the University of Michigan.  He is the author of more than 30 US patents, over 100 journal papers and has co-authored two book chapters.  He is the chairman of the IRDS roadmap committee for lithography and patterning.  Dr. Neisser worked at IBM doing semiconductor lithography research, followed by positions managing research and development of photoresists and of ancillary materials for lithography. His current research interests involve EUV resists, semiconductor patterning and related materials, and the physics of imaging or patterning such materials.

Lunch

Coffe Break

Abstract: Cryogenic Electronics and Quantum Information Processing (CEQIP) is an International Focus Team (IFT) within the IEEE International Roadmap for Devices and Systems (IRDS). CEQIP areas of coverage include superconductor electronics, cryogenic semiconductor electronics, and quantum information processing. These are developing technology areas with currently small markets but large potential. Significant technology improvements are required to meet the expected needs of applications such as quantum computing, artificial intelligence, or large-scale digital computing. This presentation covers key applications and market drivers, technology status, active research questions, technology roadmaps, and future plans.

Biography: Head of Epitaxy and Physics of Nanostructures group. Dr Pelucchi started his PhD in April 1997, working in the field of surface science and molecular beam epitaxy (MBE). His research covered MBE of II-VI materials on III-V substrates, photoemission applied to interface physics and metal-semiconductor Schottky barriers. He moved to Lausanne (EPFL) in 2001 as a research assistant (post-doc), in the group of Professor Eli Kapon. He participated to the development of research concerning metalorganic vapour phase epitaxy (MOVPE) of site controlled III-V nanostructures, working on both V-groove quantum wires and Pyramidal QDs. In May 2006 Dr Pelucchi was awarded with a Science Foundation Ireland Principal Investigator Grant. In January 2007 moved to Tyndall National Institute. where he runs the national MOVPE facility and various quantum technology projects. Dr. Pelucchi has very broad interests, spanning from surface science and epitaxy to quantum optics. He has recently acquired a relevant role in MOVPE epitaxy, having developed world leading III-V material quality and growth process understanding, while uniquely demonstrating arrays of site-controlled quantum dots and entangled photon emitters (at cryogenic temperatures).

Biography: In the 70s Dr. Gargini was a researcher at Stanford University and at Fairchild Cameraand Instrument. In 1980 as manager of MPU technology at Intel transferred intomanufacturing the iconic 80286 and 80386. In 1996, he became Director ofTechnology Strategy and responsible for worldwide consortia research until 2012. Hewas a member of Sematech, SRC, EUV LLC, EIDEC, ASET, IMEC and SIA Boards, andChairman of the I300I and NRI. From 1998 to 2015, Dr. Gargini was Chairman of theITRS sponsored by the WSC. Since 2016 he is the Chairman of the IRDS sponsored byIEEE.

Biography: In the 70s Dr. Gargini was a researcher at Stanford University and at Fairchild Cameraand Instrument. In 1980 as manager of MPU technology at Intel transferred intomanufacturing the iconic 80286 and 80386. In 1996, he became Director ofTechnology Strategy and responsible for worldwide consortia research until 2012. Hewas a member of Sematech, SRC, EUV LLC, EIDEC, ASET, IMEC and SIA Boards, andChairman of the I300I and NRI. From 1998 to 2015, Dr. Gargini was Chairman of theITRS sponsored by the WSC. Since 2016 he is the Chairman of the IRDS sponsored byIEEE.

Day 2 | 2D Tutorial & ISRDS (International Symposium on Roadmapping Devices and Systems) | 19 May, 2026

Tutorial New Materials for Electronics

Toggle Content goes here

Toggle Content goes here

Toggle Content goes here

New Directions in Computing

Abstract: Modern AI models have increasingly larger dimensions to maximize their representational capacity, requiring GPUs to perform multiplications of huge matrices. In contrast, the brain’s spiking neural networks exhibit factorially explosive encoding capacity even when their size is small. This manifesto proposes a framework for thinking about popular AI models in terms of spiking networks and polychronization, and for interpreting spiking activity as nature’s way of implementing look-up tables. This suggests a path toward converting AI models into a novel class of architectures with much smaller size yet combinatorially large representation capacity, offering the promise of a thousandfold improvement in performance.  https://arxiv.org/pdf/2512.11843

Biography: Eugene Izhikevich is the founder and CEO of SpikeCore in San Diego, the founder and Chairman of the Board of Brain Corp, and the founder and Editor‑in‑Chief of Scholarpedia, the peer‑reviewed encyclopedia.

Abstract: Hardware Ising machines offer a path to solving large-scale optimization tasks. We present an integrated Ising machine combining two nanotechnologies: memristor crossbars for multi-level coupling weights and stochastic magnetic tunnel junctions (SMTJs) as thermally driven spins. By utilizing identical read voltage to access the crossbar and bias the SMTJs, we demonstrate an intrinsic, analog-native annealing technique. Our CMOS-compatible prototype, operating at zero magnetic field, consistently finds global optima for weighted MAX-CUT and graph-coloring problems. This co-integrated approach provides a scalable, energy-efficient pathway for 3D-integrated Ising solvers.
Biography: Mohammed Akib Iftakher is a senior PhD candidate at the University of Paris-Saclay/CNRS, specializing in emerging memory technologies and analog IC design. He holds an M.Sc. in Integrated Circuit System from the University of Paris-Saclay and a B.Eng. in Electrical Engineering from the University of Malaya. His recent research on hybrid memristor-MTJ Ising machines is currently under review at Nature Communications. He is currently focused on developing CMOS-integrated, physics-inspired learning mechanisms for high-performance computing.

New Directions in Materials and Devices for Computing

Abstract: The quest for reduced switching energy in digital circuits is increasingly limited by the Boltzmann tyranny, which prescribes a minimum subthreshold swing of 60 mV/dec for thermionic emission devices. Numerous steep slope transistor concepts have been proposed in the attempt to beat this limit, none of which has yet made it to mainstream technologies. In this context, we aim to present recent results on the Dirac-Source Field Effect Transistor, a recently proposed steep slope FET exploiting the unique properties of Dirac-material / Semiconductor junctions.

Biography : Luca Selmi (PhD 1992, Fellow IEEE 2015) is Professor of Electronics at Università degli Studi di Modena e Reggio Emilia. His research interests cover modeling, simulation, and characterization of micro/nanoelectronic devices for switching and sensing. They led him to co-author more than 350 peer-reviewed publications, book chapters and a Cambridge University Press book on Nanoscale MOS Transistors. He has served as IEEE EDL associate editor, as TPC member of IEEE IEDM, VLSI Symposium, ESSDERC and as chair of numerous international conferences and events in the area of electron devices. From 2017 to 2022 he directed the IUNET consortium on nanoelectronics and he currently coordinates the EU Chips-JU project “AttoSwitch”.

Abstract: Most existing implementations of low-power electronic devices rely on the classical charge degree of freedom of electrons as the information carrier. Identifying the quantum characteristics of electrons as a new information carrier can provide a promising pathway to realize low-power electronics with functionality and performance far beyond traditional electronics. Quantum geometry—the intrinsic geometric structure of Bloch wavefunctions in momentum space—offers a compelling physical platform to address this challenge. In this talk, I will discuss our recent efforts of exploring quantum geometry in quantum materials, including its transport manifestation, non-volatile switching1, and finally the possibility of implementing a novel in-memory computing2.

References

[1] R. H. Wang et al, Nature Communications, 2025, 11298.

[2] R. H. Wang et al, Under review

Biography: Dr. Peng Song received his Bachelor degree in 2012 at Fudan University, and PhD degree in 2016 at National University of Singapore (NUS). From 2017 to 2021, he continued his postdoc research at NUS and then at Max Planck Institute of Microstructure Physics. His research in two-dimensional materials physics and electronic devices has led to several major breakthroughs in spin-orbit physics and publications in top scientific journals (Nature, Nature Materials etc). In May 2021, he was awarded the prestigious Nanyang Assistant Professorship and joined School of Electrical & Electronic Engineering, Nanyang Technological University (NTU) as an Assistant Professor. At NTU, he is interested in exploring novel device physics in low-dimensional materials and topological quantum materials, and their further integration into novel computing devices and architectures.

Abstract: High-performance computing based on von Neumann architecture suffers from high power consumption at room temperature. Cryogenic computing, including von Neumann, neuromorphic and quantum systems, offers a way forward for highly energy-efficient big data processing. CMOS technology is central to this development, but it must operate at ultra-low power under cryogenic conditions. However, conventional CMOS, which is designed for room temperature, faces significant challenges at temperatures close to absolute zero. These include an increased subthreshold swing (SS) caused by band-tail effects, as well as an elevated threshold voltage resulting from bandgap widening and Fermi-level shifts. Addressing these issues is therefore critical. This presentation will discuss these challenges and the prospects for cryogenic CMOS. The use of a single transistor based on FDSOI FET for cryogenic memory will also be addressed.

Biography : Qing-Tai Zhao completed his PhD in physics at Peking University. He then joined the Institute of Microelectronics at Peking University as lecturer and associate professor, where he focused on the research of SOI materials and devices. In 1997, he was awarded a Humboldt Research Fellowship, which led him to Forschungszentrum Jülich in Germany, where he currently leads a research group specializing in nanoelectronic devices. His primary research interests include Si-Ge-Sn based high mobility devices and technology, FDSOI and nanowire devices for low power applications, as well as ferroelectric-based neuromorphic devices and cryogenic electronics for quantum computing. He has authored and co-authored around 300 peer-reviewed publications and holds over 40 patents.

Coffe Break

Abstract: Two-dimensional materials offer unique opportunities for next-generation applications due to their atomic thickness, electrostatic tunability, and compatibility with heterogeneous integration. In this talk, I will discuss progress toward fab-compatible wafer-scale processing of 2D materials and their integration into CMOS platforms. Key challenges such as variability, interface engineering, and scalable process modules will be highlighted. I will further present recent demonstrations of nanoscale memristive devices based on 2D materials and their integration onto silicon microchips, enabling low-voltage switching and potential applications in neuromorphic computing architectures.

Biography: Burkay Uzlu received his B.S. and M.S. degrees in Physics from Bilkent University, Turkey, and his Ph.D. in Electrical Engineering from RWTH Aachen University, Germany. He was a postdoctoral researcher at Northwestern University before joining AMO GmbH, where he currently works as a Research Associate. His research focuses on the development and scalable integration of two-dimensional (2D) materials for next-generation electronic and optoelectronic devices. His work includes wafer-scale fabrication, CMOS-compatible integration, and novel device concepts such as Dirac field-effect transistors (Dirac FETs) and memristive devices for emerging computing architectures.

Abstract: Embodied Artificial Intelligence represents a paradigm shift in which intelligence emerges from the tight integration of sensing, actuation, computation, and learning within physical systems. Rather than treating AI as a purely algorithmic layer, embodied AI emphasizes the co-design of hardware, materials, and algorithms to enable adaptive, energy-efficient and context-aware behavior at the edge. This talk will introduce the core concepts of embodied AI and discuss the electronic technologies that enable it, including advanced sensors, bio-integrated and neuromorphic devices, in-memory and ferroelectric computing, and ultra-low-power edge architectures. Examples covering  robotics, wearables and cyber-physical systems will illustrate how hardware–software co-design unlocks new capabilities beyond conventional AI platforms.

Biography: Adrian Ionescu is Full Professor of Nanoelectronics at EPFL and Director of the Nanoelectronic Devices Laboratory. His research focuses on advanced semiconductor devices, energy-efficient and neuromorphic electronics, bio-integrated sensors and hardware foundations for edge and embodied AI. He has authored more than 500 scientific publications and is the recipient of multiple ERC grants, IEEE awards, and international distinctions. Prof. Ionescu is actively involved in large-scale European and international initiatives at the intersection of AI, quantum electronics, nanoelectronics and health technologies, and is a founder or scientific advisor to several deep-tech startups. He currently serves in senior academic leadership roles at EPFL, where he contributes to strategic programs in engineering

Abstract: As CMOS scaling approaches physical and energy-efficiency limits, alternative device concepts are being explored to enhance system-level computing performance. Nanoelectromechanical systems (NEMS) resonators provide intrinsic nonlinearity at ultra-low power, high quality factors, and compact footprints. In multimode NEMS devices, strong intra- and inter-modal coupling generates rich, high-dimensional dynamics, while long ring-down times enable short-term memory. These properties make NEMS attractive for physical reservoir computing and temporal signal processing. This talk presents experimental demonstrations of nonlinear multimode NEMS for time-series analysis and discusses their potential relevance to emerging heterogeneous and beyond-CMOS computing paradigms highlighted in IRDS roadmaps.

Biography: Selim Hanay is a Research Group Leader at INL – International Iberian Nanotechnology Laboratory. He received his B.Sc. in Microelectronics Engineering from Sabancı University and his Ph.D. in Physics from Caltech in 2011, where he developed NEMS-based single-molecule sensors. In 2013, he joined the faculty of Bilkent University, pioneering nonlinear NEMS and microwave resonator platforms for sensing and information processing. In 2025, he joined INL to advance NEMS-based computing architectures. He is the recipient of multiple national research awards and European Research Council (ERC) Starting and Proof-of-Concept grants.

Cocktail Dinner

  • May 18-19th

    25.03.2026.

  • University of Granada

    Spain

  • SiNANO Institute - IEEE - INPACE - EDS