Seminar – Heterogeneous 3D Chiplet Integration – Mr. Mitsusama Koyanagi
Hybrid seminar with Mitsumasa Koyanagi from Global INTegration Initiative (GINTI), Tohoku University, Japan
Francis Balestra, Director Emeritus of the SiNANO Institute, organized a seminar with a renowned expert from Japan, Mr Mitsumasa Koyanagi. Slides are now available in open access!
✴ After an introduction on the research activities of 3D integration technologies in Tohoku University/GINTI, novel 3D chiplet integration technologies using self-assembly to achieve high-throughput and high-precision multichip-to-wafer stacking were discussed.
✴ Mr. Mitsumasa Koyanagi explained the 3D AI chip fabricated using the heterogeneous 3D chiplet integration technology and implemented the vision transformer and the reservoir neural network algorithms on this 3D AI chip to perform the image recognition and voice recognition. He also briefly commented on post 5G technology and quantum computing based on heterogeneous 3D chiplet integration.
Short Bio:
Mr. Mitsusama Koyanagi is currently a senior research fellow in New Industry Creation Hatchery Center (NICHe), Tohoku University.
He has published more than 400 technical papers and given more than 200 invited talks. He was awarded IEEE Jun-ichi Nishizawa Medal, IEEE Cledo Brunetti Award, IEEE EPS Award, the National Medal Order of the Sacred Treasure, the National Medal with Purple Ribbon, the Award of Ministry of Education, Culture, Sports, Science and Technology in Japan and so on. He is an IEEE life fellow and a JSAP fellow.
Minatec – CROMA
