SiNANO Competences

Beyond CMOS

	Competences
Neuromorphic Computing	THM Modeling ofmemristor-based ANN with inherent stochastic learning Modeling and simulation of various synaptic devices Simulation, modeling and design of ANN Organic synaptic devices GINP IMEP-LaHC: Device modelling and simulation of Oxide based ReRAm LMGP: Multilevel analogue type resistive switching devices IUNET Politecnico of Milano Neuromorphic devices: fabrication and characterization Neuromorphic circuits: design and simulations University of Udine Ferroelectric based memristors: Ferroelectric Tunnelling Junctions (FTJs) and FeFETs University of Modena and Reggio Emilia Neuromorphic circuit design and simulation RWTH Coordinator of large German project “NEUROSYS”: Neuromorphic Hardware for Autonomous Artificial Intelligence Systems FZJ Synapse and neuron devices Memristor devices and their integration with CMO UAB Resistive switching devices (ReRAM): characterization and modeling. Uppsala University Tactile perception and artificial tactile peripheral nervous system Full inorganic flexible memory device Tyndall Multi-level Non-volatile memory; Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling Synaptic Transistors Ferroelectric and Multiferroic materials Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices. University of Twente Device architectures Device fabrication, Network architectures, AI URV Design and simulation of neuromorphic circuits using organic and oxide devices UGR UGR: Fabrication and characterization of neuromorphic circuits using alternative materials University of Glasgow Simulations of RRAM Simulation and Fabrication of hybrid (organic/inorganic) memories ICN2 Ferroelectric domain physics Ferroelectric domain wall physics Self-power electronics based on toxic-free 2D ferroelectric and ferroic materials (oxides, halide perovskites and MXenes)
Phonon engineering	Warsaw University of Technology Fabrication of phononic crystals using ultra high resolution e-beam lithography and anisotropic and highly selective silicon etching UAB Multiscale (ab initio, molecular dynamics, finite elements) determination of thermal transport coefficients and heat flows. Uppsala University Simulation and engineering of thermal conduction in nanostructures UGR Phonons in confined systems ICN2 Phonon transport in layered materials Nanoscale thermal transport physics and instrumentation Optomechanics Topological phononics Thermal properties of ferroelectrics and antiferroelectrics Electrocaloric effect Direct Spatially resolved Phonon detection by EELS-STEM
Small slope switches-NW/TFET/NEMS	THM Simulation and modeling of TFET, JL-FET, SB-FET, NW, RFET GINP IMEP-LaHC: Simulation of steep slope device with NEGF UCL Phase change materials (VO₂) IUNET University of Udine Modelling and simulations of: Tunnel-FETs Negative Capacitance FETs Piezoelectric FETs University of Pisa Modeling of devices based on tunnel barriers with non-equilibrium Green’s functions tools (in house nanotcad VIDES) and with commercial device simulator University of Modena and Reggio Emilia Device and mixed Device-circuit modeling and simulations Noise and Variability analysis Warsaw University of Technology Reliability and variability of TFET devices and structures (i.e., CV/IV characterization, Split-CV, and Charge Pumping), extraction of electrical properties of fabricated materials and structures, transport mechanisms identification Design and modeling of transport in TFET FZJ NW transistors TFETs Tyndall Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling Characterisation and modelling of devices (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters Material/process specific metrology: design and experimentation. Electron beam lithography (EBL). Nanoscale processing: etching, lift off. Crossover of top-down and bottom-up approaches University of Twente Ferroelectrics-based devices; Piezoelectric-based devices; Device architecture Device fabrication Device modeling UGR Monte Carlo simulation of TFETs and NWs UVR Physically-based compact modeling of TFETs University of Glasgow Electronic transport simulation using NEGF solvers. Simulation using self-consistent Schrödinger Poisson solvers ICN2 Atomic scale STEM related characterization of the related heterostructure Nano-optoelectromechanical systems (NOEMS)
Alternative materials-2D layers	GINP IMEP-LaHC: Quantum simulation of 2D material device (Graphene, MoS2 etc IMEP-LaHC: Complex dielectric permittivity measurement specific samples and in-situ LMGP: Lamellar dichalcogenides by Atomic Layer Deposition UCL Graphene IUNET University of Udine Graphene and 2D gapped materials transistors Resistance in metal-2D material contacts University of Pisa Modeling of devices based on 2D materials, on topological insulators University of Modena and Reggio Emilia Electrical characterization and modeling Politecnico of Milano Development of devices based on 2D semiconductors Warsaw University of Technology Integration of 2D materials (molybdenum sulfide – MoS2, and graphene) and nanocrystals (Si, SiC) for modern optoelectronic and photonic structures Graphene transfer onto Si substrate RWTH 2D materials based devices and characterization Participant in: Graphene Flagship 2D Experimental Pilot line other EU/national projects UAB Electrical characterization of 2D nanodevices. Development of specialized characterization set-ups. Uppsala University Graphene and transition metal dichalcogenide Sputter deposition of sulfide-based 2D materials Tyndall Developing in the next generation of logic switches which will be used in applications, covering: nanoelectronics, flexible electronics, mobile communications and low power sensor technologies. Characterisation and modelling of devices fabricated from 2D Materials (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters; Electrical test at cryogenic temperatures and understand the physics of device behaviour Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices. Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling ALD Wafer Scale Growth of 2D Materials 2D Materials for RF applications; scalability for low cost manufacture (Spectroscopic Ellipsometry, MicroRaman Spectroscopy, Infrared Spectroscopy Optical Spectrophotometry) University of Twente Atomic layer deposition of ultra-thin films (insulators, semiconductors, conductors) UGR Growth, characterization of 2D materials. Fabrication of electron devices based on 2D materials. Simulation of 2D materials and 2D materials devices (ab-initio, Monte Carlo and TCAD). Monte Carlo simulation of III-V based devices (TFETs) UVR Adaptation of Si MOSFET models to TMD MOSFETs ICN2 Ultrafast processes in graphene and related 2D materials Polycrystalline and amorphous 2D materials Free-standing oxide layers Domain Walls/oxide interfaces Thermal and elastic properties characterization 2D ferroelectric materials and MXEnes, Pb-free materials
Novel devices for ultra-low power	IUNET University of Bologna Solution of the Schrödinger/Poisson problem with the Non-Equilibrium Green’s Function (NEGF) formalism and implementing different Hamiltonians: non-parabolic effective mass, kp, tight-binding Politecnico of Torino* Design and simulation of molecular nanogap devices University of Modena and Reggio Emilia Physics-based and compact modeling of memristive devices FZJ Nanowire FETs based on high mobility materials VTT Silicon nanofabrication University of Twente Ferroelectrics-based devices; Piezoelectric-based devices; Device architecture Device fabrication Device modeling University of Glasgow Density Functional Theory and Drift-Diffusion simulations ICN2 Spin, spin waves and heat interactions Computational nanoelectronics from ab initio Computational spintronics and electronics Self-power electronics based on 2D ferroelectric and ferroic materials (oxides, halide perovskites and MXenes)
1D	IUNET University of Udine Semi-classical and quantum transport in 1D systems University of Bologna Homemade solver of the Boltzmann Transport Equation for nanowires Uppsala University Advanced silicon nanofabrication technology Other 1D semiconductor nanostructures and fabrication Devices based on carbon nanotubes and silicon nanowires Electronics of optoelectronics of 1D structures and devices Spatially and temporally resolved spectroscopy University of Glasgow CNT-based transistors and interconnects Devices based on carbon nanotubes and silicon nanowires ICN2 Atomic scale STEM related characterization of Nanowires and nanowire network systems Halide perovskites, Toxic-free halide perovskites, ferroelectric halideperovskties
Quantum Technologies & Very low temperature electronics	GINP IMEP-LaHC: Electrical characterization at very low temperature (<10K) of transistors for CMOS circuit addressing Qbits. Compact modelling for circuit simulation at very low T IUNET University of Bologna Time-dependent solution of the Schrödinger equation for the simulation of quantum bits University of Padova Low temperature measurements allowed by cryogenic probe-stations capable of sustaining temperatures as low as 7 K for prolonged measuring sessions. Electrical connections are provided by DC or RF probes. Optical coupling can be attained either by a dedicated optical fiber placed inside the vacuum-chamber or by leveraging an optical window placed on top of the sample stage. RWTH Quantum Photonics FZJ Cryogenic CMOS Toplogical insulators for quantum computing Superconducting quantum computing Uppsala University Advanced silicon nanodevice and nanofabrication technology VTT Superconducting devices Tyndall Site-controlled quantum dots, which were proven as efficient single and entangled photon emitters, both by optical excitation and electrically driven. Modelling of site-controlled QD system demonstrating single and entangled photon emission Expertise in atomistic modelling, in particular using methods from first-principles. Study the materials without any input parameters to predict and tune the required properties. Apply to enhance the oscillator strength and engineer external coupling Cryoelectronics for quantum technology. Electrical test at cryogenic temperatures and understand the physics of device behavior. Quantum electronic devices and sensors. Material characterisation – electrical and TEM. Modelling of functional devices (continuum based modelling) In-situ and 3D imaging using electron and ion beam microscopy. Correlative characterisations: different modes of analysis at different length scales to obtain additional information. Material/process specific metrology: design and experimentation. Electron beam lithography (EBL). Nanoscale processing: etching, lift off, chemical surface modifications. Crossover of top-down and bottom-up approaches University of Twente Single-atom transistors (fabrication and cryogenic testing) University of Glasgow Non-Equilibrium Green’s Function Simulations Quantum Simulations Superconducting qubits simulations Semiconductor qubits ICN2 Rare-earth ions Quantum computation Atomic scale STEM related characterization of quantum systems Phonons impact on noise in quantum systems

More Moore

	Competences
Logic Nanodevices& circuits	THM Simulation and modeling of multiple-gate FET, NW-FET Fast multiscale simulation approach for quantum transport in ultrashort MOSFETs GINP IMEP-LaHC: General and historic expertise in CMOS device electrical characterization, modelling and simulation. Circuit simulation in VerilogA using compacts models (some in-house) KTH FD SOI CMOS technology platform SiGe and Ge MOSFET devices IUNET University of Modena and Reggio Emilia Device and mixed Device-circuit modeling and simulation Electrical characterization at wafer level Noise and Reliability modeling University of Bologna Cell-based design flow for implementation of digital and analog low-power IPs in BCD and CMOS technology, in cooperation with STMicroelectronics in the framework of ECSEL JU R2POWER300 and R3POWERUP projects and of the Joint ARCES-ST lab University of Calabria Device-circuit simulations Electrical characterization at wafer level Reliability modeling University of Roma “La Sapienza” CMOS digital standard cell design Digital circuit characterization and modeling Power optimization of digital circuits Politecnico of Torino VLSI architectures, mixed-signal design, Logic Synthesis and Optimization, Process Variation-Aware Design University of Udine III-V and 2D semiconductor based transistors Fin-FETs, nanowire and stacked nanowire FET University of Pisa Multiscale modeling of nanoscale transistors from ab-initio simulations of materials to device simulation with non-equilibrium Green’s functions tools (in house nanotcad VIDES) and with commercial device simulator University of Padova FINFETs and scaled MOS devices Warsaw University of Technology Materials synthesis and growth (PECVD, PVD, thermal methods) MOS test devices processing Reliability and variability of MOS/MIS devices and circuits (i.e., CV/IV characterization, Split-CV, and Charge Pumping), extraction of electrical properties of fabricated materials and structures, conduction mechanisms verification Ultra-shallow RF plasma implantation of nitrogen/fluorine for improvement of electro-physical properties of MOS structures or modification of growth kinetics of particular dielectric layers Semiconductor nanocrystals (Si, SiC, ZnO) embedded in dielectric ensembles – technology and characterization Optimization and design of electrical properties of fabricated materials using Design-of-Experiments (DoE) method RWTH Transistors Inverters Ring oscillators High k-dielectrics NCSRD Nanowire MOSFETS UAB Reliability of CMOS devices and integrated circuits. Electrical characterization and Modeling of 2D semiconductor based FETs for digital applications Development of specialized characterization set-ups and smart analysis techniques Modelling of quantum transport and simulation of nanometer scale devices using a multi-scale approach from ab-initio methods (SIESTA, BITLLES) to compact modelling. Modelling and simulation of ultra-small SOI-based MOSFETs in the scaling limit. Development of transistors for low-power switching applications based on ferroelectric materials University of Liverpool Design for Test (DFT) architectures, 3D circuits, reliability Novel hardware security solutions Process, Voltage and Temperature (PVT) Variation Aware Test IEMN RF and mixed signal circuit design for telecommunications VTT Nano CMOS and FDSOI circuits, sub- and near threshold ULP circuits, neural processing units Tyndall Gate stack development for III-V nanowire CMOS technology, combining RF and logic on the one Si chip. Modelling and engineering of interfaces and interface states. Characterisation and modelling of devices (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters; Electrical test at cryogenic temperatures and understand the physics of device behaviour. University of Twente C-V and I-V characterization; Interface state measurement, reliability UVR Development of the first physically-based compact models for cylindrical nanowire MOSFETs and junctionless nanowires UGR Development of circuits based on reconfigurable FET devices University of Glasgow Electronic transport simulation using NEGF solvers. Simulation using self-consistent Schrödinger Poisson solvers Terahertz nonlinearities ICN2 Reconfigurable logics Electronic transport simulation using NEGF solvers. Simulation using self-consistent Schrödinger Poisson solvers Terahertz nonlinearities Atomic scale STEM related characterization
Memories	GINP IMEP-LaHC: Device modelling and simulation of Oxide based ReRAm IMEP-LaHC: New architectures of memories (Z²FET) for DRAM LMGP: Valence change nanoionic resistive switching devices UCL Design of SRAMs in advanced CMOS technologies IUNET University of Modena and Reggio Emilia Device-circuit simulations Electrical characterization at wafer level Material-device simulations University of Bologna Modeling and simulation of advanced non-volatile memory concepts (NVM) for new applications, such as ultra-low power computing, high-density and low-cost data storage, novel functions, communications and consumer electronics University of Calabria Device-circuit simulations Electrical characterization at wafer level University of Ferrara Electrical characterization and modeling of non-volatile memories reliability Politecnico of Milano Design of memory-based hardware security primitives Modeling and simulation of advanced Flash and emerging memory devices University of Roma “La Sapienza” TACD, characterization, engineering, reliability test Politecnico of Torino Nanomagnetic memories University of Udine Floating-gate and charge-trap non volatile memories Ferroelectric based memories University of Pisa Three dimensional modeling of non-volatile memories University of Padova Non-Volatile Floating gate memories: new issues in 3D devices Warsaw University of Technology Materials synthesis and growth (PECVD, PVD, thermal methods) MOS test devices processing Reliability and variability of MOS/MIS devices and circuits (i.e., CV/IV characterization, Split-CV, and Charge Pumping), extraction of electrical properties of fabricated materials and structures, conduction mechanisms verification Ultra-shallow RF plasma implantation of nitrogen/fluorine for improvement of electro-physical properties of MOS structures or modification of growth kinetics of particular dielectric layers Semiconductor nanocrystals (Si, SiC, ZnO) embedded in dielectric ensembles – technology and characterization Optimization and design of electrical properties of fabricated materials using Design-of-Experiments (DoE) method RWTH Non-volatile memory devices FZJ Ferroelectric devices NCSRD Si nanocrystal memories, Phase-change memories UAB Resistive switching devices (ReRAM): characterization and modeling. Uppsala University Silicon-compatible memory devices Full inorganic flexible memory device University of Liverpool ReRAM, ALD processed dielectrics and characterization VTT Memristors Tyndall Ferroelectric and Multiferroic materials Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling; Spintronics UGR 1T-DRAM memories (devices and applications) University of Glasgow Molecular based memories Flash memories: variability and reliability Ferroelectric memory devices Self-power electronics (transistors) based on 2D ferroelectric and ferroic materials (oxides, halide perovskites and MXenes) ICN2 Magnetic random access memories Modeling for magnetic, ferroelectric, and multiferroic materials. Simulation of spin torque phenomena (STT-MRAM, SOT-MRAM) Ferroelectric memory devices Self-power electronics (transistors) based on 2D ferroelectric and ferroic materials (oxides, halide perovskites and MXenes)
Very low power devices	Uppsala University Low power intrabody network Tyndall Spintronics; Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling. Exploit fundamental understanding through atomic scale modeling for electronic devices and nanoscale systems to propose new materials and novel configurations for nanoelectronic devices, where their entire functionality could be driven from physical effects corresponding to a few atoms. Develop an atomic scale model to evaluate electrical and mechanical properties of proposed material system ICN2 Phonon-electron and phonon-photon coupling in nano-optoemectronic devices Materials and devices for selff-power electronics (transistors, memoristors) based on 2D ferroelectric and ferroic materials (oxides, halide perovskites and MXenes)
High temperature electronics	GINP IMEP-LaHC: Expertise in SiC (part of manufacturing, electrical characterization and modelling). Collaboration on GaN ICN2 Hot carriers in graphene and related 2D materials

More than Moore

	Competences
Micro-nano-bio Sensors & Systems	THM MEMS Pressure, Infrared, Temperature Sensors MEMS process and device modeling GINP IMEP-LaHC: Development of novel sensor architectures and new approaches of more efficient dynamic signal for detections. Electrical characterization of sensors IMEP-LaHC:Design of microelectrodes, DEP LMGP: Deposition of Oxide thin films and nanostructures for gas sensors LMGP: Integration of seminconducting nanonets (nanowire networks) KTH Implantable bio-sensors Si nanowire top-down fabrication UCL Simulation, fabrication, characterization of biological, chemical and physical sensors, notably in SOI CMOS compatible technology or for harsh environments (temperature, radiations) IUNET University of Modena and Reggio Emilia Modeling and simulation of ion, particle and bio-sensor devices at device level (sensitivity, selectivity, noise) Extraction of equivalent circuits University of Bologna Ultra-low-noise and high-accuracy readout circuits for sensors and biosensors High performance analog front-end design for industrial applications Characterization of sensors and circuits CMOS-integrated readout circuits for capacitive/resistive/resonant (current/magnetic/strain/bio-) sensors Piezoelectric sensors Design and prototyping of piezoelectric transducers Design of CMOS capacitive interfaces for 3D IC wireless connection, in cooperation with STMicroelectronics in the framework of JTI ESiP project, and of CMOS active bio-electrodes for brain electrical imaging Politecnico of Milano MEMS accelerometers, gyroscopes, magnetometers, ultrasonic transducers, MEMS resonators for real time clocks and other timing applications University of Perugia Radar sensors and microwave radiometer sensors Radiation sensors modeling (TCAD) and design University of Roma “La Sapienza” Engineering, Electronic Interface, sensor fusion Growth of low temperature silicon nanowires Politecnico of Torino Electrochemiluminescent and electrochemical sensors, nanogap biomedical sensors, wireless sensor network design, neural network sensors, Integrated Sensors and Sensor Fusion University of Udine modeling of potentiometric chemical/bio-sensors and bio-actuators Modeling of nanodevices for neural recording Warsaw University of Technology Graphene transfer and etching; Low negative impact of fabrication on graphene parameters RWTH Photodetectors Pressure sensors Humidity sensors Strain sensors NCSRD Thermal sensors (gas and liquid flow, chemical, acceleration and pressure sensing), Microfluidics, Capacitive pressure sensors, bio-sensors, RF-based sensors Uppsala University Silicon-based nanobiosensor design and fabrication Microchip-based biosensor Electro-fluidic devices High dimensional biology University of Liverpool Nanowire Sensors (detect changes in surface potential) Compact On-Chip Fluorescence by combining wafer bonding and microfluidics DNA electronics (single molecule and polymers) Surface chemistry for bio-sensors Bacterial and Fungal Bio-Simulation Molecular Motors (Myosin-Actin) VTT MEMS, bolometers, superconducting sensors, biosensors Tyndall Electrochemical sensors Silicon and polymer microneedles for smart patches, University of Twente Lab-on-chip, Organ-on-chip: system architecture, prototyping, applications UGR Biosensors based on 2D materials for early diagnosis Gas sensors based on 2D materials (electronic nose) University of Glasgow Silicon-based nanobiosensor design and fabrication DFT calculations of materials properties Chemical sensors simulations ICN2 DFT calculations of materials properties Chemical sensors simulations Graphene based electrodes and Graphene SGFET for biosensing Aptamer-based inkjet-printed flexible microfluidic devices Graphene-based electrochemical biosensors VIK-ETT Biosensor development, thin film layers development, nanometrology
Energy Harvesting	GINP IMEP-LaHC: Full expertise in piezo mems and nems characterization and modelling, assisted by state of the art AFM for electrical characterization IMEP-LaHC: Photovoltaics: 3D electromagnetic modelling coupled with TCAD tools for PV cells simulation, characterization (quantum efficiency, reflectivity, SHG, transport mechanisms, passivation….) IMEP-LaHC: Fully coupled mechanical/piezoelectrical/semi-conducting FEM simulation of nanostructures, electromechanical response IMEP-LaHC: Characterization under mechanical stress (pressure, flexion) IMEP-LaHC: AFM characterization: PFM, KPFM, CAFM, SMIM LMGP: All-oxide solar cells as PV harvesters for outdor and indoor applications LMGP: Piezoelectric nanogenerators made of ZnO nanowires KTH Low power circuit design UCL Solar cells (black Si, CIGS, CZTS) : fabrication, characterization, simulation Design of ULP CMOS harvesters for light, thermal and RF energy IUNET University of Modena and Reggio Emilia HW-SW co-design Innovative transducers University of Bologna Nano-power and ultra-low voltage integrated circuits for energy harvesting and power management Multi-source energy harvesting circuits RF energy harvesting (circuits for RF power transfer down to uW) University of Padova Power conversion topologies and techniques for Wiegand transducers and photovoltaic cells University of Perugia Wireless Power Transfer systems Wireless Power lines University of Roma “La Sapienza” Solar cell Thermoelectric cells University of Padova Power conversion topologies and techniques for different renewable energy sources Low power fully integrated dcdc converters for TEG harversters Conventional characterization techniques: IQE, EQE, reflectivity, light/dark I-V measurements, C-V measurements, transient Voc measurements Advanced characterization techniques: photocurrent spectroscopy, capacitance deep-levels transient spectroscopy (C-DLTS), spatially and wavelength-resolved electro-luminescence measurements Development of custom experimental setups for interfacing with sample-specific geometries and structures Evaluation of the degradation mechanisms limiting the short- and long-term reliability of solar cells: aging under different temperature, bias and optical excitation conditions analysis of the variation of device performance during accelerated aging experiments Development of degradation models based on experimental data and theoretical analyses Warsaw University of Technology Energy harvesters performance characterization Fabrication of suspended thin-film Si membranes NCSRD Piezo-resistive devices, electromagnetic energy harvesting Uppsala University Thermoelectrics Triboelectric nanogenerators (TENG) RF energy harvesting University of Liverpool Materials and devices for energy harvesting using rectenna technology Materials for PV IEMN Silicon-based thermoelectricity using nano-phononics Thermoelectricity based on thermionic emission VTT Thermoelectrics, work function harvesting, supercapacitors Tyndall Thermoelectric energy harvesting Supercapacitors Piezoelectric harvesting particularly in the area of AlN Microelectromagnetic Energy Harvesters University of Twente PV on chip University of Glasgow Ground state DFT calculations, and Molecular Dynamics ICN2 Spin caloritronics Thermoelecticity Ground state DFT calculations, and Molecular Dynamics Piezo electricity (Ultrafast) energy, charge and heat dynamics in condensed matter Bulk photovoltaic effect in ferroelectrics Piezoelectricity and Flexoelectricity Atomic scale STEM related characterization Photovoltaics, solution processable materials for printed perovskite solar cells. Integration of energy harvesters with photovoltaics ( solar, mechanical, vibrational energy, etc.) VIK-ETT Energy Harvesting in applied sensors
RF devices & circuits	GINP IMEP-LaHC: TeraHertz characterization of material and devices THz characterization of material in the 0.2- 3 THz band Characterization of THz detectors and emitters IMEP-LaHC: Passive circuits IMEP-LaHC: RF characterization up to 110 GHz (+probe station) IMEP-LaHC: RF Design KTH Low power circuit design UCL Modelling and characterization of RF passive and active devices Design of CMOS RF circuits and sub-systems IUNET University of Modena and Reggio Emilia Device simulations Design and characterization of transceivers operating at RF and mm-waves Electrical characterization at wafer level (DC, pulse, I-DLTS) RF Load-pull measurements (1.7GHz-2.5GHz, 10GHz) University of Bologna UWB localization systems at cm-level Experience in IC circuit design for RF applications. Among the blocks composing the front-end of RF transceivers, the circuit activity was principally focused on the design of VCOs and frequency synthesizers University of Padova Design of RF and mm-wave integrated circuits in CMOS, BiCMOS and bipolar technology Analysis of the trapping processes that limit the dynamic performance of the devices, based on current-DLTS, capacitance-DLTS, optical-DLTS, backgating investigation. Development of physical models of the charge-trapping processes. Study of the interface traps by C-V, D_it and V_th transient measurements. Analysis of issues related to devices with Schottky gate. Study of hot electron effects, by means of electroluminescence measurements. Evaluation of the long-term reliability of packaged devices by means of dedicated burn-in systems equipped with DC and RF stress capabilities and with variable-temperature stages. Long-term high-temperature storage tests for devices on-wafer. (up to 1100 °C). University of Perugia Building block design and testing (LNA, mixers, VCO…) on cellulose-based materials, reconfigurable power amplifiers, tunable matching networks, RFIDs and RFID sensors Chipless RFIDs University of Roma “La Sapienza” TCAD simulation of high frequency response of semiconductor structure Politecnico of Torino Power amplifier design on III-V and III-N platforms, low-noise amplifier design, RF and microwave characterization and modeling, physics-based modeling of III-V and III-N devices, H-terminated diamond FETs University of Udine Modeling of transistor noise RF circuit design High Speed Serial links RWTH RF Transistors RF diodes Characterization up to 11GHz NCSRD RF passive devices (co-planar waveguides, filters, antennas) Local low-loss RF substrate for the on-chip integration of devices UAB Modelling and simulation of graphene and post-graphene 2D materials based field effect transistors targeting RF applications Uppsala University Passive and active circuits University of Liverpool Antennas and rf power devices & technology IEMN Ultimate thinning and transfer bonding for enhanced RF performance VTT Active and passive components and circuits in RF, mm-wave and THz range, antennas Tyndall ALD Wafer Scale Growth of 2D Materials 2D Materials for RF applications; scalability for low cost manufacture (Spectroscopic Ellipsometry, MicroRaman Spectroscopy, Infrared Spectroscopy Optical Spectrophotometry) RF MEMS Switches Hybrid SAW and EM resonators RF tuning methods University of Twente RF MEMS device design, fabrication and characterization UVR Development of some of then first modeling frameworks for Multi-Gate MOSFETs at high frequencies ICN2 Spin torque induced ferromagnetic resonance Quantum control Coupling phonons to RF Terahertz spectroscopy and technologies NFC/RFID wireless biosensors and gas sensors VIK-ETT RFID applications
Photonics devices	GINP IMEP-LaHC: Modelling of photodetectors (Ge, Si) or PV application, device electrical characterization, in particular in low temperature, focused on the degradation mechanisms of these device for reliability assessment IMEP-LaHC: Integrated photonics : Glass photonic (ion exchange, 3D integration) Hybrid photonics (glass interposer, polymer-glass devices, wafer-bonding and 3D integration) Silicon Photonics Photonic based sensors IMEP-LaHC: Photonic Design and test of optical and electro-optical functions 3 D electromagnetic modelling for integrated optics Characterization: integrated photonic characterization bench, digital transmission (Radio over Fiber, FFTH…) test benches LMGP: Light emitting diodes made of ZnO nanowires LMGP: Self-powered UV photodetectors made of ZnO nanowires KTH III-V epitaxy (MOVPE) of GaAs and InP-based materials and device structures Edge-and surface-emitting lasers and detectors Heterogeneous integration UCL Thin SOI photodiodes (UV to visible) with graphene gate, optical reflectors… SOI waveguides with graphene modulators IUNET University of Modena and Reggio Emilia Device simulation Electrical and optical characterization University of Bologna Advanced architectures for silicon based solar cells and optcal MEMS theoretically analyzed by means of accurate TCAD simulations University of Calabria Device simulation Electrical and optical characterization University of Padova Characterization, physical modeling, reliability and simulation of LEDs, laser diodes, solar cells, multi-quantum well solar cells and photodiodes based on various binary, ternary and quaternary material systems, such as GaN, GaAs, InP, Si and CdTe. Electrical characterization capabilities: I-V (with fA resolution) executed in DC or pulsed mode, C-V measurements (from quasi-static to 20 MHz). Conventional optical characterization: L-I, EL spectra, PL spectra (variable excitation wavelength). Advanced optical characterization: spatially and wavelength-resolved EL imaging (through a scientific CCD camera), photocurrent spectroscopy, differential carrier lifetime analysis. Defects characterization: light-CV measurements, C-DLTS, deep-level optical spectroscopy (DLOS). Evaluation of devices performance in function of temperature (from 7 K to 650 K). Characterization and modeling of the lifetime-limiting mechanisms in function of temperature, bias and optical excitation during device aging. Physics-based numerical simulation of semiconductor devices through Synopsys Sentaurus or Apsys (from Crosslight) software suites. University of Perugia Multi-octave Analog laser predistortion for RoF systems University of Roma “La Sapienza” Characterization, Reliability test Politecnico of Torino Design of high-speed detectors, electroabsorption modulators, electro-optic modulators, QW lasers, III-N LEDs, FIR image sensors on MERCATEL, QW III-V solar cells, passive element modelling and design University of Udine Modelling, characterization and optimization of photodetectors Solar Harvesting, Optical Wideband Antenna, Rectenna Warsaw University of Technology Dielectric, conductive, and semiconductor materials synthesis for optoelectronic and photonic devices technology Full line-up for optical characterization of fabricated materials and structures, i.e., optical spectroscopy, high-resolution laser spectroscopy, spectroscopic ellipsometry, refractometry, confocal microscopy, high-resolution spectrophotometer with a helium cryostat for absorption, and advanced spectrofluorometric system for emission/excitation/fluorescence kinetics measurements, Optical Backscattering Reflectometry (OBR) Optimization and design of optical properties of fabricated materials using Design-of-Experiments (DoE) method, as well as commercially available software to obtain tailored properties (transparency, reflection, etc.) of obtained layers and periodic stacks that can be used in novel nanophotonic structures which possess tailorable and dynamically controllable spectral and angular optical properties Design, modeling, and fabrication of nanophotonic multi-layer and metamaterial structures in thin- and ultra-thin regime (especially planar tunable hyperbolic metamaterials) based on novel semiconductor, dielectric, and conductive materials Advanced design and modeling of semiconductor and photonic structures using in-house software development and commercially available capabilities (COMSOL, Macleod) based on well-established models of electromagnetic fields interact with matter Design and simulation of photonic integrated circuits (PICs) Fabrication of photonic elements and PIC based on Si, Ge, SiN Optical and electrical characterization of photonic elements and circuits Design and fabrication of diffractive optical elements, microlenses, holograms for visible and EUV wavelengths RWTH Silicon and silicon nitride photonics 2D photodetectors Multispectral photodetectors High speed photodetection FZJ GeSn photonics NCSRD Solar cells, Theoretical modeling of waves in the micro- and nano-scale University of Liverpool Utilizing semiconductor optoelectronic devices / systems to realize compact Lab-on-chip equivalents for bio- and chemical sensors IEMN Electro-optical interposers for advanced packaging VTT Silicon photonics Tyndall Nanostructuring of CMOS compatible materials for applications in photonics. Design, fabrication and characterization of Photonic Integrated Circuits (PICs) and nanophotonic devices. The fabrication processes are typically based on electron beam lithography suite. University of Twente Photodiodes, SI light emitters, Si optocouplers UGR Photonic applications of 2D materials UVR Technology for highly efficient organic solar cells. Circuit-based modeling of these devices ICN2 Nanopatterning surfaces and metamaterial design for photonic components Photodetectors Nonlinear light converters Atomic scale STEM related characterization Radiative cooling surfaces
Power devices	KTH SiC BJT and MOSFETs UCL Simulation and characterization of power devices in harsh environments (temperature, radiations) IUNET University of Modena and Reggio Emilia Electrical characterization at wafer level (DC, pulse, I-DLTS) Reliability modeling Device simulation University of Bologna Characterization of power MOSFETs and IGBTs Characterization of GaN HEMT and SiC power MOSFETs Electrical and thermal analysis of packaged power devices Characterization, physical modeling, reliability and simulation of Analysis of the trapping processes that limit the dynamic performance of the devices, based on current-DLTS, capacitance-DLTS, optical-DLTS, backgating investigation Development of physical models of the charge-trapping processes Study of the interface traps by C-V, Dit and Vth transient measurements Analysis of issues related to devices with Schottky, insulated and p-type gate Study of the lifetime-limiting mechanisms in GaN- and SiC-based transistors and diodes: time-dependent dielectric breakdown, instability of the p-type and insulator layers, hot electron effects (studied by electroluminescence) Long-term high-temperature storage tests for devices on-wafer (up to 1100 °C) Physics-based numerical simulation of semiconductor devices through Synopsys Sentaurus software suite University of Calabria Electrical characterization at wafer level Reliability modeling University of Padova Characterization of power MOSFETs and IGBTs Characterization of GaN HEMT power MOSFETs Characterization, physical modeling, reliability and simulation of FETs – with and without gate insulator -, diodes and natural superjunctions based on various binary, ternary and quaternary material systems, such as GaN, GaAs, GaO and Si. Knowledge of electrical, optical, capacitive and thermal characterization techniques for the analysis of device performance, degradation and deep level concentration. Expertise in advanced characterization techniques, such as capacitive, current, transient, optical, admittance, photocurrent and interface states deep level spectroscopy, analysis of dynamic performance, spatially- and spectrally-resolved electroluminescence and photoluminescence – both front- and back-side Politecnico of Torino III-N power transistors, Si power devices, EMC integrated circuit design, EMI characterization of integrated circuits University of Pisa Multiscale modeling (from ab-initio to circuit simulation) of devices based on GaN and SiC. Modeling of defects and traps in GaN and SIC Warsaw University of Technology Detailed electrical characterization, extraction of electrophysical parameters (static and pulse I-V, C-V, stress and sense, breakdown) FZJ SiC power devices NCSRD RF passives for power devices University of Liverpool Oxides and interfaces on GaN: materials characterization Tyndall SiC technology Power supply-on-chip University of Twente Si, GaN device architecture and characterization UVR Co-author of the ASM HEMT compact model, standardized by the Compact Modeling Council as one of the two GAN mainstream models for microwave and poser applications
Flexible electronics	THM Simulation and modeling of submicron organic TFT devices Non-quasistatic modeling of organic TFTs Modeling variability of organic TFTs Simulation of organic permeable-base transistors GINP LMGP: Deposition of thin oxide films by Spatial ALD, ALD and CVD. P-type oxides LMGP: Composite materials (nanowires, nanoparticles, oxides) LMGP: Flexible and stable fabrication of transparent electrodes based on metallic nanowire networks LMGP: Nanonet-based devices IMEP-LaHC: Passive circuits IMEP-LaHC: Antenna systems IMEP-LaHC: RF design and characterization KTH Graphene based super capacitors UCL Ultra thinning of SOI CMOS dies to a few µm by XeF₂ Transfer of high-quality monolayer graphene on flexible substrate IUNET University of Udine Piezoresistance sensors based on 2D semiconductors University of Modena and Reggio Emilia Electrical characterization and modeling of printed devices University of Padova Characterization of organic devices for electronics (thin film transistor), optoelectronics (organic LEDs and light emitting transistors), and photovoltaics (polymeric solar cells, dye sensitized solar cells, perovskite solar cells). Politecnico of Torino Organic solar cells, molecular organic devices University of Perugia Electronic on cellulose and on “non conventional materials” (cellulose as a paradigm) University of Pisa Ink-jet printed electronics based on 2D material Warsaw University of Technology TFT devices processing and electrical characterization Reliability and variability of TFT devices and structures (i.e., CV/IV characterization, Split-CV, and Charge Pumping), extraction of electrical properties of fabricated materials and structures, transport mechanisms identification RWTH Flexible electronics with 2D materials NCSRD Organic light emitting diodes, organic photovoltaics UAB Electrical characterization and modeling of inkjet-printed devices, Organic TFTs. Uppsala University Nanomaterials, devices and systems Flexible PCBs Full inorganic flexible memristor device University of Liverpool Development of low-cost flexible organic circuits for use as key functional block in various mixed signal applications i.e. sensors and displays Organic physical device modelling VTT Printed intelligence, roll-to-roll fabrication University of Twente P3HT OFETs & VOFETs (fabrication) Device physics, characterization, Modelling, and TCAD UGR Development of sensors based on flexible substrates Flexible Electrophoretic displays based on graphene and graphene-related devices. Flexible transparent electrodes UVR Author of some of the mainstream models and direct parameter extraction methods for organic and oxide TFTs University of Glasgow Electronic properties from first-principles Simulation of charge transport in organic matter (polaron transport) 2D spintronics Electronic properties from first-principles. Modeling different physical properties (structural, piezoelectric, magnetic, thermal, etc.) ICN2 Electronic properties from first-principles Simulation of charge transport in organic matter (polaron transport) 2D spintronics Electronic properties from first-principles. Modeling different physical properties (structural, piezoelectric, magnetic, thermal, etc.) Graphene and 2D materials electronics Flexible graphene solution-gated field-effect transistors Flexible electronics based on 2D materials for interfacing with the nervous system; implantable medical devices Hydrophobic micro-nanostructured films Defectivity and dimensional metrology of nanopatterned devices Nanoparticles-based printed passive components Free-standing oxide films/membranes Thermal and electronic (experimental) transport in disordered (and crystalline) organic matter Stable organic glasses for optoelectronic and photovoltaic devices Solution processable materials (2D, halide perovskites, oxides) for printed electronics (lab scale and larger areas): inks and pastes VIK-ETT Wearables, flexible PCBs, additive manufacturing technologies

Smart systems

	Competences
Smart systems	UCL Design of CMOS systems-on-chip (analog, RF, digital, memories) especially in attached UTBB FD SOI with adaptive back bias IUNET University of Modena and Reggio Emilia Circuit design Architecture design Electrical testing University of Bologna IoT sensor nodes with advanced power management for operation with uW energy harvesting Energy autonomous nodes for IoT applications: wireless nodes with embedded sensing, processing, communication and actuating capabilities using energy harvesting from surrounding environment. Activity carried out in the framework of joint STMicroelectronics-ARCES laboratory also in the framework of ECSEL Connect project University of Calabria Circuit design Architecture design Electrical testing Politecnico of Milano MEMS systems (sensors + integrated or discrete electronics for specific final applications) University of Perugia Embedded system, Lab-on-chip building blocks University of Roma “La Sapienza” Design, engineering, algorithms and machine learning Politecnico of Torino Embedded systems, Smart Systems for Robotics and Biomedical Applications University of Pisa Design and characterization of MEMS-based sensors (resonant mass sensors, accelerometers) and actuators (micro mirrors). Phononic devices modeling and characterization University of Padova Smart microgrids Internet of energy (IoE) Warsaw University of Technology Design and assembly of dedicated measurement tools, power supplies, and embedded systems with the integrated optoelectronic and photonic devices; SMD assembly and reliability tests NCSRD Mass flow meter (applications in automotive and respiration control), bioanalytical microsystems Uppsala University Neuromorphic skin Intelligent prosthetics University of Liverpool Utilizing semiconductor optoelectronic devices / systems to realize compact Lab-on-chip equivalents for bio- and chemical sensors Dielectrophoresis; characterisation of cells and nanoparticles; automated bioreactors; biomimetic cell culture, microfluidic cell handling IEMN Smart packaging Laser-based micromachining for advanced packaging VTT Wireless and zero power systems, multi-modal systems Tyndall Edge Processing Interoperability Platform Smart self powered mobile embedded systems for Condition Based Monitoring Human Machine Interface Wearable AR/VR ICN2 NFC wireless IoT sensors

Competences

Smart systems

UCL

Design of CMOS systems-on-chip (analog, RF, digital, memories) especially in attached UTBB FD SOI with adaptive back bias

IUNET

University of Modena and Reggio Emilia
- Circuit design
- Architecture design
- Electrical testing
University of Bologna
- IoT sensor nodes with advanced power management for operation with uW energy harvesting
- Energy autonomous nodes for IoT applications: wireless nodes with embedded sensing, processing, communication and actuating capabilities using energy harvesting from surrounding environment. Activity carried out in the framework of joint STMicroelectronics-ARCES laboratory also in the framework of ECSEL Connect project
University of Calabria
- Circuit design
- Architecture design
- Electrical testing
Politecnico of Milano
- MEMS systems (sensors + integrated or discrete electronics for specific final applications)
University of Perugia
- Embedded system, Lab-on-chip building blocks
University of Roma “La Sapienza”
- Design, engineering, algorithms and machine learning
Politecnico of Torino
- Embedded systems,
- Smart Systems for Robotics and Biomedical Applications
University of Pisa
- Design and characterization of MEMS-based sensors (resonant mass sensors, accelerometers) and actuators (micro mirrors). Phononic devices modeling and characterization
University of Padova
- Smart microgrids
- Internet of energy (IoE)

Warsaw University of Technology

Design and assembly of dedicated measurement tools, power supplies, and embedded systems with the integrated optoelectronic and photonic devices; SMD assembly and reliability tests

NCSRD

Mass flow meter (applications in automotive and respiration control), bioanalytical microsystems

Uppsala University

Neuromorphic skin
Intelligent prosthetics

University of Liverpool

Utilizing semiconductor optoelectronic devices / systems to realize compact Lab-on-chip equivalents for bio- and chemical sensors
Dielectrophoresis; characterisation of cells and nanoparticles; automated bioreactors; biomimetic cell culture, microfluidic cell handling

IEMN

Smart packaging
Laser-based micromachining for advanced packaging

VTT

Wireless and zero power systems, multi-modal systems

Tyndall

Edge Processing Interoperability Platform
Smart self powered mobile embedded systems for Condition Based Monitoring
Human Machine Interface Wearable AR/VR

ICN2

NFC wireless IoT sensors

System design

	Competences
Systems design	KTH Feasibility study, Architecture partition, Design hardware/software, Test and Validation UCL PCB level integration of ultra low power systems : sensors, energy harvesting, analog and digital signal processing, RF chips, passive RFID tags, antennas IUNET University of Modena and Reggio Emilia Circuit design Architecture design Electrical testing University of Bologna Design of sensor systems for structural health monitoring applications Interfacing piezoelectric transducers and accelerometers Design of low-power and high performance computing systems End-to-end deployment and optimization of machine learning applications on embedded computing systems Compilers and programming models for embedded and high-performance computing systems University of Calabria Circuit design Architecture design Electrical testing University of Ferrara Solid State Drives FPGA with emerging non-volatile memories Politecnico of Milano MEMS systems (sensors + integrated or discrete electronics for specific final applications) University of Padova AC/DC, DC/DC, DC/AC power conversion design from few watts up to tens of kWatts Design of fully integrated low power radio transceivers for Internet of Things (IoT) applications. Design of fully integrated high resolution radar transceivers. UAB Device compact modeling for Reliability-Aware Design of ICs. Uppsala University Tactile neuromorphic circuitry Biomedical systems VTT Sensor systems and networks, RF and communication systems VIK-ETT Circuit design, module design, thermomechanical simulations, design validation, quality, reliability

Competences

Systems design

KTH

Feasibility study, Architecture partition, Design hardware/software, Test and Validation

UCL

PCB level integration of ultra low power systems : sensors, energy harvesting, analog and digital signal processing, RF chips, passive RFID tags, antennas

IUNET

University of Modena and Reggio Emilia
- Circuit design
- Architecture design
- Electrical testing
University of Bologna
- Design of sensor systems for structural health monitoring applications
- Interfacing piezoelectric transducers and accelerometers
- Design of low-power and high performance computing systems
- End-to-end deployment and optimization of machine learning applications on embedded computing systems
- Compilers and programming models for embedded and high-performance computing systems
University of Calabria
- Circuit design
- Architecture design
- Electrical testing
University of Ferrara
- Solid State Drives
- FPGA with emerging non-volatile memories
Politecnico of Milano
- MEMS systems (sensors + integrated or discrete electronics for specific final applications)
University of Padova
- AC/DC, DC/DC, DC/AC power conversion design from few watts up to tens of kWatts
- Design of fully integrated low power radio transceivers for Internet of Things (IoT) applications. Design of fully integrated high resolution radar transceivers.

UAB

Device compact modeling for Reliability-Aware Design of ICs.

Uppsala University

Tactile neuromorphic circuitry
Biomedical systems

VTT

Sensor systems and networks, RF and communication systems

VIK-ETT

Circuit design, module design, thermomechanical simulations, design validation, quality, reliability

SiNANO Competences

SiNANO Institute