INL – International Iberian Nanotechnology Laboratory

Contact persons:

Clivia Sotomayor-Torres

International Iberian Nanotechnology Laboratory
Avenida Mestre José Veiga s/n
4715-330 Braga
Portugal

Equipment / Facilities

Processing platform

  • Thin Film Deposition and Material Growth:
    • Molecular beam epitaxy of InSe, GaSe, In2Se3 2D materials
    • Multi-target Singulus sputtering tool for magnetic tunnel junctions and thin-film multilayers (Timaris MTM)
    • Multi-target confocal sputtering tool (Kenosistec)
    • Metallization Singulus sputtering tool for Al, TiW(N) and Al2O3 (Timaris FTM)
    • EasyTube 3000 Graphene CVD furnace system
    • SPTS MPX CVD system for oxides, oxi:nitrides and a-Si:H deposition
    • PECVD (800ºC) systems for CNT and carbon layers deposition tool (MicroSys 400 from Roth & Rau Microsystems)
    • Cu Electroplating (AMMT GmbH)
    • Atomic Layer Deposition (Beneq TFS 200)

    Etching, Ashing, and Micromachining

    • Broad Beam ion milling with SIMS end point detect (Nordiko 7500)
    • Fluorine-based reactive ion etch system for oxides / nitrides (SPTS APS)
    • Chlorine-based reactive ion etch systems for metals (SPTS ICP and SPTS C2L ICP)
    • Silicon Deep reactive ion etching system (SPTS Pegasus)
    • Plasma asher (PVA TEPLA M360)
    • TMAH / KOH Si etch tanks (AMMT GmbH)
    • Multiple fume hoods and wet benches for chemical processes (Quimipol)
    • Oxide vapour etch release system (SPTS/PRIMAXX uEtch)
    • XeF2 isotropic Si etch system (Xactic X4)
    • Supercritical CO2 point dryer (Tousimis)

    Optical and E-beam Lithography

    • E-beam lithography tool (Vistec 5200 ES 100 kV)
    • Nanoimprint Lithography (Obducat Eitre8)
    • Direct write laser lithography (Heidelberg DWL 2000)
    • Mask aligner (Karl Suss MA BA model)
    • Optical resist track (Karl Suss Gamma Cluster)
    • E-beam resist track (Karl Suss Gamma Cluster)
    • Multiple ovens, including vapour priming
    • Coater and hotplates for substrates up to 300 mm (SCS/EMS)
    • Custom and uFab (Newport) femtosecond laser based 3D microfabrication (microprinting)

    Advanced Packaging, Annealing, and Back-end Processes

    • Chemical Mechanical Planarization (Logitech ORBIS)
    • Dicing saw (Disco DAD 3500)
    • Wire Bonder / Aluminium Wedge, Pick and Place (TPT HB)
    • Wire Bonder / Gold ball bond (TPT HB)
    • Pick and place (Finetech Fineplacer Sigma)
    • Advanced desktop research printer (LP50 Roth & Rau B.V.)
    • Magnetic Annealer with field up to 2T and temperature up to 400C (TEL, MATR 2000)

    For more information: https://inl.int/services/research-core-facilities/micro-and-nanofabrication/

Modelling platform

  • Ansys Lumerical
  • Raytracing (Zemax)

Characterization platform

    • Conventional Transmission Electron Microscope (TEM): JEOL JEM-2100
    • Probe corrected Scanning Transmission Electron Microscope (STEM): FEI Titan ChemiSTEM
    • Double corrected TEM/STEM: FEI Titan Cubed Themis coupled with EELS, a segmented detector, a pixelated detector, a heating/biasing holder, a cryo holder, a liquid holder, a gas holder and a tomography holder.
    • Dedicated Cryo-TEM: Thermo Scientific Glacios
    • Scanning Electron Microscope (SEM)/Environmental SEM: FEI Quanta 650 FEG
    • DualBeam Focused Ion Beam (FIB)-SEM: FEI Helios NanoLab 450S
    • X-Ray Photoelectron Spectrometer: Thermo Scientific Escalab 250Xi
    • Full-equipped sample preparation laboratory

    More information: https://inl.int/wp-content/uploads/2024/01/INL_BROCHURES_AEMIS.pdf

     

    Metrology, Inspection, and Wafer-Scale Device Testing

    • High-resolution SEM (NanoSEM, FEI)
    • Contact profilometer (KLA TENCOR P-16+)
    • Resistivity mapper (AITCO)
    • Optical profilometer/ellipsometer (OPM hyperion with confocal sensor / Ocean Optics NanoCalc XR)
    • Multiple automated wafer probers for electrical testing and others
    • Radio Frequency Electrical Characterization Laboratory (up to 40Ghz in frequency domain and 20GHz in time domain)
    • Manual and motorized optical microscopes for Automatic Optical Inspection

    Advanced multispectral microscopy setups:

    • Custom developed Optical Decetected Magnetic Resonance (ODMR setups for quantum metrology) in widefield and confocal microscopes
    • Fluorescence Lifetime Imaging (FLIM) microscopy setups
    • Nonlinear SHG and MP-FLIM microscopy
    • Streak imaging (spectral temporal characetrization)
Expertise
Main Expertises
Beyond CMOS Neuromorphic Computing
  • Beyond CMOS Neuromorphic Computing • Design, fabrication and characterisation of spintronic neural networks, with magnetic tunnel junctions acting as both neuron and synapse component as part of several ongoing EU projects
  • III-V nanophotonic devices; nanoLEDs, nanolasers, nano-photodetectors for neurosynaptic devices; polymer photonic devices and 2D/3D interconnects; • Designing multifunctional and reprogrammable nanodevices for spintronic neural networks operating in the frequency domain
  • Design of nanophotonic devices; design optical interconnects; neuromorphic optical sensing and computing; nonlinear dynamical systems; spiking neural networks
Phonon engineering
  • Nanoscale thermal transport
  • Phonon waveguides and circuits
  • Optomechanics
Small slope switches-NW/TFET/NEMS x
Alternative materials-2D layers
  • Simulation of electronic, optical and magnetic properties of 2D materials (graphene, transition metal dichalcogenides, chromium trihalides, magnetic 2D materials)
  • Fabrication of Graphene field-effect transistors at the wafer scale; integration of graphene material into classical cleanroom techniques.
  • Fabrication of optoelectronic devices based on InSe, GaSe, In2Se3 2D materials
  • Advanced characterization of 2D materials to determine their atomic structure-composition, phases, electric-field and charge distribution.
Novel devices for ultra-low power
  • Transition metal dichalcogenide memristors
1D
  • Fabrication, characterization and modelling 1D van der Waals Heterostructures
  • Correlating magnetic behavior with structure, understanding structural phase transitions
Quantum Technologies & Very low temperature electronics
  • Using quantum computers for quantum simulation
  • Single-photon emitters from h-BN
  • Quantum sensing based on Nitrogen Vacancy centers in diamond
  • Growth and characterization of topological insulators
More Moore Logic Nanodevices & circuits x
Memories
  • 2D materials memristors
  • Smart interconnects
Very low power devices
  • Passive MEMS inertial logger (configurable low power inertial switch)
High temperature electronics x
More than Moore Photonic devices
  • III-V nanophotonic devices; nanoLEDs, nanolasers, nano-photodetectors; polymer photonic devices: MZM modulators; 3D optical waveguides, quantum sensing platforms based on diamond
Micro-nano-bio Sensors & Systems
  • Graphene field-effect transistors designed for biosensing with aptamers, DNA, antibodies
  • Microneedles for drug delivery and fluid sampling
  • Microfluidic devices for biomarker isolation from body fluids
  • Optofluidic devices: integrating optical and plasmonic (SERS) sensors in microfluidic devices for biomolecule analysis.
  • Organ-on-a-chip devices and systems
  • Measuring devices based on SERS-based sensors integrating sample preparation, microfluidics and selective detection and quantification
  • Measuring devices based on electrochemical sensors integrating sample preparation, microfluidics and selection detection and quantification
Energy Harvesting
  • Wireless energy harvesting
  • Triboelectric and electrostatic energy harvesting
RF devices & circuits
  • Magnetic tunnel junctions used for a range of rf functions, including rf sources, detectors, filters, random number generation, PUFs
THz spectrum
  • Micro optics for THz spectrum applications (beam shaping, splitting, polarizers)
  • Modelling THz spin excitons in magnetic 2D materials and magnetic molecules
  • Modelling graphene plasmons in the THz and their coupling to magnons
Photonics devices
  • Fabrication of 2D materials single-photon emitters (hBN)
  • High frequency (1MHz) MEMS-based optical modulator
  • Integrated Photonics Devices e.g. for biosensing, quantum information and neuromorphic photonic computing
Power devices x
Flexible electronics
  • Flexible (capacitive and resistive) pressure and temperature sensors, polymer-embedded passive components (microinductors), chip-on-flex integration and packaging
  • Flexible piezoelectrets for self-powered sensing application
Smart systems& Systems design Smart systems
  • IoT and Smart Cities:
  • Smart Homes and Buildings:
  • Smart Grids
  • Industry 4.0 and smart manufacturing processes.
  • Predictive maintenance and condition monitoring in industries.
  • Artificial intelligence and machine learning for smart systems.
  • AI for optofluidics control and analysis.
  • Embedded Systems
  • Cloud Computing
  • Cyber-Physical Systems
  • IoT (Internet of Things)
  • Edge computing for IoT devices
  • Communication protocols and standards for IoT
  • Human-Computer Interaction (HCI)
  • Machine Learning Systems
  • Harvesting/passive sensors system integration
Systems design Ultra high sensitivity: Pull-in transduction mechanism for inertial MEMS
Research interests
Research interests
Beyond CMOS Neuromorphic Computing
  • Designing multifunctional and reprogrammable nanodevices for spintronic neural networks operating in the frequency domain
  • Design of nanophotonic devices; design optical interconnects; neuromorphic optical sensing and computing; nonlinear dynamical systems; spiking neural networks
Phonon engineering
  • Low energy interconnect
  • Non-charge based state variables
  • Variability, fluctuations and noise
Small slope switches-NW/TFET/NEMS x
Alternative materials-2D layers
  • Modelling excitations (magnons, excitons, plasmons) in 2D materials. Modelling proximity effects in 2D materials
  • Graphene chemical sensors (biological sensors, gas sensors); graphene radiofrequency devices for communication
  • Fabrication of optoelectronic devices based on InSe, GaSe, In2Se3 2D materials
  • Using HAADF STEM, STEM-EELS, DPC-STEM and COM-STEM to understand 2D materials at the atomic level.
  • Aberration Corrected STEM and Spectroscopy, Low T Cryo-TEM and Insitu TEM
Novel devices for ultra-low power
  • TMDC materials and devices
1D
  • Electronic and magnetic properties of single wall nanotubes of ferromagnetic materials (ex: CrX3) encapsulated in multiwall carbon nanotubes
  • Aberration Corrected STEM and Spectroscopy
  • Low T Cryo-TEM and Insitu TEM
Quantum Technologies & Very low temperature electronics
  • Develop novel quantum metrology technologies for material and biological sensing applications
  • Graphene/h-BN chip for photon emission on-demand
  • Electric current-to-spin current conversion efficiency
  • Use aberration corrected STEM to create defects ranging from pairs of vacancies to antidot lattices
More Moore Logic Nanodevices & circuits x
 Memories
  • 2D materials devices
  • Printed Memristor for memory application
  • Integrated photonic neuromorphic computing hardware
 Very low power devices
  • Modelling and fabricating passive and latching MEMS structures to stick when reaching certain acceleration values, and reset them through powered actuation
Photonic devices
  • Optoelectronics, nanophotonics, III-V compound semiconductors; design of optical active devices; nanofabrication; two-photon polymerization, quantum metrology for thermometry and magnetometry
More than Moore micro-nano-bio Sensors & Systems
  • Quantification of small molecules (dopamine, GABA, serotonin), detection of genetic biomarkers of cancer (glioma), diagnostic of infectious diseases (malaria, respiratory infections)
  • Less invasive drug delivery and diagnostics (microneedle with integrated sensors for wearable diagnostics)
  • Diagnosis, prognosis and prediction of diseases: cancer, metabolic, inflammatory, neurodegenerative.
  • Plasmonic devices efficient, robust and mid mass-scale development and fabrication.
  • Understanding biology of diseases by developing novel organ-on-a-chip devices that integrate nano-based sensors.
  • Development of SERS- and electrochemical-based measuring devices for water contaminants monitoring: early warning systems, portable and automated platforms, AI/ML applied to sensors’ analytics
Energy Harvesting
  • Novel spintronic based rectifiers targeting low power operation
  • Energy Harvesters for wearables
RF devices & circuits
  • Explore novel radiofrequency functionality of nanoscale devices which convert magnetic properties (i.e. resonance) for electrical devices (i.e. rf detectors)
THz spectrum
  • Design and modelling of micro optics for this domain
Photonics devices
  • Quantum communication (?)
  • PICs for biosensing, quantum information and neuromorphic photonic computing
Flexible electronics x
Smart systems
  • Wearable devices for health monitoring and diagnostics.
  • Telemedicine and remote patient monitoring.
  • Smart logistics and supply chain management.
  • Industry 4.0 and smart manufacturing processes.
  • Predictive maintenance and condition monitoring in industries.
  • Artificial intelligence and machine learning for smart systems.
  • Edge-based machine learning for low-latency applications.
  • Accessibility and inclusivity in smart technologies.
  • Embedded Systems
  • Cloud Computing
  • Cyber-Physical Systems
  • IoT (Internet of Things)
  • Edge computing for IoT devices
  • Communication protocols and standards for IoT
  • Human-Computer Interaction (HCI)
  • Machine Learning Systems
 System design Ultra high sensitivity:

  • Pull-in approach to increase robustness to 1/f noise sources and increase bias stability to achieve ultra-low g resolution.