Chair for Micro – and Nanoelectronics at RWTH Aachen University
Processing platform
- Dielectric deposition: LPCVD, ALD (Si3N4, SiO2, Al2O3)
- Thin film deposition: E-Beam evaporation, Sputtering (Al, Ti, TiN, W, Ni, Cr, Co, HfO2)
- 2D material deposition: CVD (graphene), ALD, PECVD
- Pattern transfer: ICP/RIE (anisotropic profiles, smooth surfaces, F and Cl based etch chemistry)
- Lithography: E-Beam lithography, Optical lithography (6” Mask Aligner, 6” I-line stepper), Interference lithography, Nanoimprint lithography
- Wet chemistry
- Critical point drying
- Wafer dicing
Modelling platform
- Lumerical FDTD (Photonics, Sensors)
- Ansys Electronics HFSS (Photonics)
- Phoenix OptoDesigner (Photonics)
Characterization platform
- Automated SEM
- Raman spectroscopy (532 nm, 637nm, 785 nm laser): Photo luminescence, photo current mapping, in-situ pressure/humidity
- Electrical characterization: temperature range (20 K -600 K), DC, RF (up to 110 GHz)
- Optical characterization: Light sources with 850 nm, 1310 nm, 1550 nm, tunable sources, electro optic, temperature rang (20 K – 600 K)
- Spectroscopic ellipsometry
- Atomic force microscope
- Optical microscope