Abstract
The workshop will focus on key areas of the INPACE Cluster dedicated to “Enabling technologies – Chips for the future” and is aligned with the topics defined in the Digital Partnerships between EU and Japan. The presentations and discussions will cover the many semiconductor challenges (complex value chain, computing and storage needs, novel functionalities for electronic systems, circuit and system integration, energy & material needs, reliability) and possible technological solutions, especially: reductions of energy and material consumption for sustainable electronic systems, advanced logic devices and materials, integration of novel functionalities for future electronic systems (e.g. smart sensing, energy harvesting for autonomous system, power devices, photonics, cryoelectronics for quantum engineering), heterogeneous 3D integration and packaging for high performance, low power, low latency, miniaturisation, integration of new functionalities and lower cost of electronic systems, and possible cooperation on gaps in the semiconductor value chain.
This workshop is associated with the newly launched “Japan and EU Semiconductors: Mutual Innovation & Excellence” JASMINE Project.
Day 1
Opening Remarks
9:00 – 9:10
Francis Balestra - Opening Remarks
Session 1 – Smart Sensors
9:10 – 10:25
Alan O’Riordan – Tyndall National Institute: Smart Sensors
Genki Yoshikawa – NIMS
Ken Uchida – University of Tokyo: Molecular Sensors for Smart Society
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Session 2 – Process Technology & Manufacturing & Sustainability
10:25 – 12:00
Nadine Collaert – imec: The Future of Compute: From Atomic-Scale Scaling to System-Level Integration
Laurent Pain – CEA-LETI : The necessary transformation to secure a sustainable semiconductor industry
Atsushi Ogura – Meiji University
Session 3 – Policy Session
13:35 – 14:24
Olivier Brigner - European Commission: Europe’s semiconductor strategy
Tomoshige Nambu - METI: Japan’s semiconductor strategy
Session 4 – Energy Harvesting
14:24 – 15:40
Gustavo Ardila – University Grenoble-Alpes: ZnO thin films and nanowires for piezoelectric energy transducer applications
Takao Mori – NIMS: Thermoelectric energy harvesting and cooling technology; New developments
Takeaki Sakurai – University of Tsukuba: Tailoring the Physical Properties of Narrow-Gap Semiconductor Mg2S Thermoelectric Thin Films through Defect Engineering
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Session 5 – Quantum Computing
16:00 – 16:50
Jean-Charles Barbe – Quobly: Quantum Computing using Si-based Qubits
Seigo Tarucha – RIKEN: High-fidelity of spin Qubits in silicon
Session 6 – Neuromorphic Computing
16:50 – 17:40
Sayani Majumdar - Tampere University: Neuromorphic Electronics for Intelligence Everywhere
Shinichi Takagi - Teikyo University: Physical Reservoir Computing Utilizing HfO2-based Ferroelectric Devices for Edge-AI Applications
Day 2
Session 1 – Heterogeneous Integration and Advanced Packaging
8:45 – 10:00
