Tyndall National Institute

Contact persons:

Giorgos Fagas, Paul Hurley

22 Thomas Street,
Dublin 8

Ireland

Tyndall National Institute, UCC – leading European research centre – expertise in nanotechnology, photonics, electronics.

Equipment / Facilities

Processing platform

ALD, CVD material deposition systems
Metal deposition and etch systems
Post-deposition wafer processing including dicing and wire-bonding

Modelling platform

Atomistic modelling
Materials process modelling
Metal-MoS₂ interface modelling
1D and 2D multigate FET modelling

Characterization platform

Electrical Characterisation incudinga range of manual and automatic probe stations
Mechanical characterisation
Spectroscopic analysis
Microscopy including SEM and TEM

Further details are available at the following link: https://www.tyndall.ie/services

Expertise

		Main Expertises
Beyond CMOS	Neuromorphic Computing	Multi-level Non-volatile memory; Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling Synaptic Transistors Ferroelectric and Multiferroic materials Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices.
	Phonon engineering	x
	Small slope switches-NW/TFET/NEMS	Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling Characterisation and modelling of devices (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters Material/process specific metrology: design and experimentation. Electron beam lithography (EBL). Nanoscale processing: etching, lift off. Crossover of top-down and bottom-up approaches
	Alternative materials-2D layers	Developing in the next generation of logic switches which will be used in applications, covering: nanoelectronics, flexible electronics, mobile communications and low power sensor technologies. Characterisation and modelling of devices fabricated from 2D Materials (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters; Electrical test at cryogenic temperatures and understand the physics of device behaviour Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices. Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling ALD Wafer Scale Growth of 2D Materials 2D Materials for RF applications; scalability for low cost manufacture (Spectroscopic Ellipsometry, MicroRaman Spectroscopy, Infrared Spectroscopy Optical Spectrophotometry)
	Novel devices for ultra-low power	x
	1D	x
	Quantum Technologies & Very low temperature electronics	Site-controlled quantum dots, which were proven as efficient single and entangled photon emitters, both by optical excitation and electrically driven. Modelling of site-controlled QD system demonstrating single and entangled photon emission Expertise in atomistic modelling, in particular using methods from first-principles. Study the materials without any input parameters to predict and tune the required properties. Apply to enhance the oscillator strength and engineer external coupling Cryoelectronics for quantum technology. Electrical test at cryogenic temperatures and understand the physics of device behavior. Quantum electronic devices and sensors. Material characterisation – electrical and TEM. Modelling of functional devices (continuum based modelling) In-situ and 3D imaging using electron and ion beam microscopy. Correlative characterisations: different modes of analysis at different length scales to obtain additional information. Material/process specific metrology: design and experimentation. Electron beam lithography (EBL). Nanoscale processing: etching, lift off, chemical surface modifications. Crossover of top-down and bottom-up approaches
More Moore	Logic Nanodevices& circuits	Gate stack development for III-V nanowire CMOS technology, combining RF and logic on the one Si chip. Modelling and engineering of interfaces and interface states. Characterisation and modelling of devices (e-beam lithography, sub 10nm wafer scale processing); Strong track record in Si processing, device fabrication and electrical test; Optimise process parameters; Electrical test at cryogenic temperatures and understand the physics of device behaviour.
	Memories	Ferroelectric and Multiferroic materials Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling; Spintronics
	Very low power devices	Spintronics; Device design and fabrication (micrometre and nanometre scales), structural and electrical characterisation of materials and devices, performance analysis and modelling. Exploit fundamental understanding through atomic scale modeling for electronic devices and nanoscale systems to propose new materials and novel configurations for nanoelectronic devices, where their entire functionality could be driven from physical effects corresponding to a few atoms. Develop an atomic scale model to evaluate electrical and mechanical properties of proposed material system
	High temperature electronics	x
More than Moore	micro-nano-bio Sensors & Systems	Electrochemical sensors Silicon and polymer microneedles for smart patches,
	Energy Harvesting	Thermoelectric energy harvesting Supercapacitors Piezoelectric harvesting particularly in the area of AlN Microelectromagnetic Energy Harvesters
	RF devices & circuits	ALD Wafer Scale Growth of 2D Materials 2D Materials for RF applications; scalability for low cost manufacture (Spectroscopic Ellipsometry, MicroRaman Spectroscopy, Infrared Spectroscopy Optical Spectrophotometry) RF MEMS Switches Hybrid SAW and EM resonators RF tuning methods
	Photonics devices	Nanostructuring of CMOS compatible materials for applications in photonics. Design, fabrication and characterization of Photonic Integrated Circuits (PICs) and nanophotonic devices. The fabrication processes are typically based on electron beam lithography suite.
	Power devices	SiC technology Power supply-on-chip
	Flexible electronics	x
Smart systems& Systems design	Smart systems	Edge Processing Interoperability Platform Smart self powered mobile embedded systems for Condition Based Monitoring Human Machine Interface Wearable AR/VR
Smart systems& Systems design	Systems design	x

Research interests

		Research Interests
Beyond CMOS	Neuromorphic Computing	Exploring alternative semiconductor materials and device structures aimed at improving energy efficiency in the next generation of logic switches which will be used in applications, covering: nanoelectronics, flexible electronics, mobile communications and low power sensor technologies. Emerging Materials and Devices for future nanoelectronic, ICT and spintronics applications, including simulation of emerging device concepts. Emerging Materials and Devices for future nanoelectronic, ICT and spintronics applications, including fabrication, characterisation and modelling of devices. Focus is on addressing key technological challenges that are essential to the future evolution of Integrated Circuits (ICs) beyond Moore’s Law, needed for the future Trillion Sensor economy of the Internet of Things (IoT), and smart systems/cities. Materials science, particularly in the synthesis, understandings and optimisation of room temperature ferroelectric and multiferroic thin films for beyond CMOS data storage applications.
	Phonon engineering	x
	Small slope switches-NW/TFET/NEMS	Developing next generation logic
	Alternative materials-2D layers	2D materials for memory and neuromorphic computing Characterisation of devices based on 2D materials Modelling of Next Generation Devices. including simulation of emerging device concepts. Emerging Materials and Devices for future nanoelectronic, ICT and spintronics applications, including fabrication, characterisation and modelling of devices. Materials development for ‘Emerging Materials and Devices’ programmes. Materials development for scalable low-power RF manufacturing
	Novel devices for ultra-low power	x
	1D	x
	Quantum Technologies & Very low temperature electronics	Developing sources of quantum light based on III-V materials, and epitaxially grown by MOVPE (Metalorganic Vapour Phase Epitaxy). MOVPE fundamentals for process optimization. Quantum Theory related to Quantum Computing Applications. Electronics to enable Quantum Computing Technologies. Calculations on interactions of quantum states. Emerging Materials and Devices for future nanoelectronic, ICT and quantum applications, including fabrication, characterisation and modelling of nanowire devices. Si based qubit readers and sensors Si based qubit readers and sensors.
More Moore	Logic Nanodevices& circuits	Exploring alternative semiconductor materials and device structures aimed at improving energy efficiency in the next generation of logic switches which will be used in applications, covering: nanoelectronics, flexible electronics, mobile communications and low power sensor technologies. Emerging Materials and Devices for future nanoelectronic, ICT and quantum applications, including fabrication, characterisation and modelling of nanowire devices. Next generation ‘gate-all-around’ device architectures.
	Memories	Materials science, particularly in the synthesis, understandings and optimisation of room temperature ferroelectric and multiferroic thin films for beyond CMOS data storage applications. High endurance and low power random access memory. Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices.
	Very low power devices	Emerging Materials and Devices for future nanoelectronic, ICT and spintronics applications, including fabrication, characterisation and modelling of devices. Focus is on addressing key technological challenges that are essential to the future evolution of Integrated Circuits (ICs) beyond Moore’s Law, needed for the future Trillion Sensor economy of the Internet of Things (IoT), and smart systems/cities. Atomic-scale simulations of materials (semimetals, semiconductors, oxides, organic materials, etc) including the effects of doping, vacancies and other defect types. Also, atomic-scale quantum transport simulations of nanoelectronic devices, including field-effect transistors, heterostructures, memories, metal-material interface, spin-based devices.
	High temperature electronics	x
More than Moore	micro-nano-bio Sensors & Systems	Gold plasmonic nanostructure arrays for disease detection Gold nanowires integration as functional electrochemical devices
	Energy Harvesting	Novel thermoelectric and piezoelectric materials fabrication and the implementation of these in device development Novel Supercapattery (Supercapacitor + Battery) devices to build 3D-integrated, heterogeneous smart systems
	RF devices & circuits	Materials development for scalable low-power RF manufacturing incl. additive manufacturing Reconfigurable versatile front-end Multi-functional front-end transceivers RF codesigned filters and gain stages Miniaturisation and performance enhancement Low-cost integration
	Photonics devices	x
	Power devices	High Frequency Magnetic Materials for Integrated Power Conversion Applications
	Flexible electronics	x
Smart systems& Systems design	Smart systems	x
Smart systems& Systems design	Systems design	x

Tyndall National Institute

Tyndall National Institute

SiNANO Institute