University of Twente
Contact persons:
Ray Hueting
University of Twente
Drienerlolaan 5
7522 NB Enschede
Netherlands
Minatec – CROMA
3 Parvis Louis Néel, CS 50257
38016 Grenoble Cedex 1, France
+33 456 52 95 09
sinano@minatec.grenoble-inp.fr
Novel computing architectures (Neuromorphic, Quantum...)
- Neuromorphic computing; fabrication & physics
- Quantum computing; fabrication & physics
Small slope switches-TFET/Fe Transistors/Dirac-Source FET/NEMS...
- Ferroelectric/Piezoelectric field-effect transistors; fabrication
and device physics - NEMS-based switches; fabrication and device physics
Alternative materials-2D layers
- Pure boron layers
Very low temperature electronics
- Electrical analysis of devices and circuits in cryogenic
environment
Research interests
Novel computing architectures (Neuromorphic, Quantum...)
- Single-electron transistor
- Single-atom transistor
- Ferroelectrics-based memristors
Small slope switches-TFET/Fe Transistors/Dirac-Source FET/NEMS...
- Novel ferroelectric/piezoelectric-based FETs/switches
- Novel NEMS-based devices
Alternative materials-2D layers
- Pure boron for power and photonics devices
1D Devices/NW/CNT
Very low temperature electronics
- Novel devices & circuits for cryogenics
- Novel characterization methods
Main expertises
Logic Nanodevices & circuits/FDSOI, Nanosheet, Stacked channels...
- FDSOI nanodevices and circuit design
- Fabrication and 3D silicon nanomachining
Research interests
Logic Nanodevices & circuits/FDSOI, Nanosheet, Stacked channels...
- Novel nanoscaled 3D device structures
Main expertises
RF devices & circuits
- RF analog and mixed signal circuit design
Photonics devices
- Physics and technology of photodiodes and light-emitting diodes
- Photonic integrated circuits (PICs); optocoupler design
- Optical wave guides; design & fabrication
Power devices
- Device physics and fabrication of power devices
Research interests
RF devices & circuits
- Novel functionalities for RF analog & mixed-signal applications
Photonics devices
- Novel photodetectors and light emitters; optocouplers
- Novel optical wave guides
Power devices
- Novel silicon power devices & ICs
- Novel wide bandgap (e.g., GaN, SiC) power devices & ICs
Main expertises
Heterogeneous Integration, & Advanced Packaging
- Multiphysics (e.g., electro-thermal, thermo-mechanical, electro-
mechanical) and physics-based compact modelling and
characterization of advanced chip packaging
Research interests
Heterogeneous Integration, & Advanced Packaging
- Developing special test structures/methodologies for accurate
modelling of new materials/device properties - Developing new physics-based models
- NEMS based resonators and oscillators